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Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Paper No: IPACK2022-97440
DOI: https://doi.org/10.1115/IPACK2022-97440
... understanding of the interface’s robustness and evolution under operational loads. In this study, the TIM-Cu interfaces were subjected to high temperatures prior to measuring the interface’s critical stress intensity factors. Four-point bend specimens were fabricated and subjected to sustained high temperatures...
View Paper titled, Evolution of the Interface <span class="search-highlight">Critical</span> <span class="search-highlight">Stress</span> <span class="search-highlight">Intensity</span> <span class="search-highlight">Factors</span> Between TIM Copper Substrates due to High-Temperature Isothermal Aging
Click here to open pdf in another window PDF for Evolution of the Interface <span class="search-highlight">Critical</span> <span class="search-highlight">Stress</span> <span class="search-highlight">Intensity</span> <span class="search-highlight">Factors</span> Between TIM Copper Substrates due to High-Temperature Isothermal Aging
Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress