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Keywords: delamination
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Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Paper No: IPACK2022-97427
... Abstract Potting is one of the most effective techniques for safeguarding electronics assembly in challenging harsh conditions, including shock and vibration. Interconnect failures are often preceded by delamination at the PCB and epoxy interface. PCB-Epoxy interfaces have not been extensively...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
... against shock, vibration, moisture, and radiation. Underfills provide great mechanical support to the solder interconnects and limit the amount of plastic work during temperature excursions. Delamination is of the significant failure modes observed at chip-UF interfaces. Chip-UF interfaces have not been...
Proceedings Papers
Fatigue Delamination Crack Growth of Potting Compounds in PCB/Epoxy Interfaces Under Flexure Loading
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A012, October 7–9, 2019
Paper No: IPACK2019-6572
... systems which when mixed together form a solid, fully-cured material, with no by-products. The cured potting materials are prone to interfacial delamination under dynamic shock loading which in turn potentially cause failures in the package interconnects. The study of interfacial fracture resistance...
Proceedings Papers
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 609-615, July 6–8, 2011
Paper No: IPACK2011-52260
... will be investigated. Comprehensive reliability data will help to select the right package type for next generation large die large body flip chip application. KEYWORDS Lead Free, Flip Chip, SPL, FCmBGA, EOL, MRT, TC-B, TC-H, TC-J, Underfill, Warpage, Delamination, Reliability INTRODUCTION Lead based solder has been...
Proceedings Papers
Margaret Stern, Bob Melanson, Vadim Gektin, Paul Hundt, Carlos Arroyo, Vikas Gupta, Kazumi Nakayoshi, Lyndon Larson, Jesus Marin, David McDougall, Dorab Bhagwagar
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 309-317, July 8–12, 2007
Paper No: IPACK2007-33629
... voids and delamination in the TIM1 layer. A dark ring or picture frame artifact is observed at the die perimeter in acoustic microscope images of packages with the Ag-filled TIM1. Detailed SEM cross-section and thermal mapping analyses on a number of specially constructed FC packages have been...
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1669-1677, July 17–22, 2005
Paper No: IPACK2005-73495
... Interfacial Fracture Toughness Thin Film Delamination Mode Mixity Micro-Scale Nano-Scale Proceedings of InterPACK 05: IC exe curr pro met can frac film 100 KE Mo INT with cou duri prop applications to help improve the adhesion of otherwise weakly 1 Copyright © 2005 by ASME fabrication...
Proceedings Papers
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 641-645, July 17–22, 2005
Paper No: IPACK2005-73446
... 03 04 2009 The paper parametrically assesses the impact of the voids/delamination on the system thermal performance. Analysis are carried out numerically and validated against experimental data (thermal measurements and C-SAM images). Topics covered include the relationship between...
Proceedings Papers
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 309-316, July 6–11, 2003
Paper No: IPACK2003-35082
...-Chip BGA Die Crack Bump Fracture Delamination Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 611, 2003, Maui, Hawaii, USA underfill exhibit i necessity to co packaging materi observed that FCB packages withou between underfills such as die...
