... developed to meet these design targets. Compared with conventional cooling techniques, which are normally applied only on one side of the power module, a double-sided cooling approach enables higher power density and lower thermal resistance. In this work, we develop a three-phase power module...

... silicon. However, lateral GaN devices introduce packaging difficulties, especially when attempting a double-sided cooled solution. Herein, we describe optimization efforts for a 650V/30A, GaN half-bridge power module with an integrated gate driver and double-sided cooling capability. Two direct bonded...