... Abstract With the minimization trend of component size, electromigration is becoming an increasingly important concern. Current studies mainly focused on predicting the EM time to failure (TTF) based on Black’s equation. By simulating the current and temperature, TTF of test structures can...

... Abstract Numerical analysis of electromigration in solder joints has mainly examined ball grid arrays (BGAs) in flip-chip packages, and few numerical study has been reported on solder joints in power modules. This report describes an electromigration analysis of solder joints for power modules...

... deformation and the electrical stress due to electric current. According to scaling down of electric devices, the current density and Joule heat in interconnect line increase and electromigration (EM) damage becomes a serious problem. EM is a transportation phenomenon of metallic atoms caused by electron wind...

... Abstract Power modules are being developed with the aim of increasing power output. Achieving this aim requires increased current density in power modules. However, at high current densities, power modules can degrade as a result of electromigration, which is a phenomenon where atoms move due...

... Abstract Lead free solder materials have replaced lead based solder materials nowadays for increased environmental concern. Further miniaturization of electronic solder joints in packages has caused electromigration to dominate among all the reliability issues found in electronic packages...

... density. As outlined in the International Technology of Roadmap for Semiconductors (ITRS), this trend makes electromigration the limiting factor in high density packages. The heightened current density and correspondingly elevated operating temperatures are a critical issue in reliability since...