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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97587
... are made on the reduction in fan power due to the improved chassis design and any reduction in temperatures of air-cooled components. datacenter air-cooling hybrid cooling energy savings ducting chassis optimization Proceedings of the ASME 2022 International Technical Conference...