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Keywords: extreme temperature testing
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111984
... the high-strain rate behavior and temperature dependent aging behavior of the solder junctions for FE analysis. SAC solders vibrations under high temperatures high strain rate properties extreme temperature testing Anand viscoplasticity model FE analysis Proceedings of the ASME 2023...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111981
... curves for the solder ball joints are examined under various thermal aging circumstances for drop/shock events. Effect of various operating temperatures and aging durations on hysteresis loops and plastic work densities have been studied. SnAgCu solders extreme temperature testing Anand...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
... ball joints. SAC-Q high strain rate testing extreme temperature testing Anand viscoplastic model drop/shock event FE model Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022...