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Keywords: four-point bend
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97440
... understanding of the interface’s robustness and evolution under operational loads. In this study, the TIM-Cu interfaces were subjected to high temperatures prior to measuring the interface’s critical stress intensity factors. Four-point bend specimens were fabricated and subjected to sustained high temperatures...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74062
... energy release rate at steady state stress is important in selection of the potting material and the reliability study of the supplemental restraint systems. PCB/Epoxy specimens are prepared, and their fracture behavior is observed under quasi-static three-point and four-point bend loading. In three...