1-20 of 20
Keywords: heat sink
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112005
..., becomes difficult to ascertain whether the rate of heat transfer is being dominated by forced or natural convection. This may lead to ambiguity in choosing an optimal heat sink solution and a suitable system mechanical design due to unknown flow regimes, further leading to sub-optimal system performance...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112019
... Abstract This paper proposes a computational fluid dynamics (CFD) simulation methodology for the multi-design variable optimization of heat sinks for natural convection single-phase immersion cooling of high power-density Data Center server electronics. Immersion cooling provides the capability...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112452
... to move precisely in the x, y, and z directions with high precision, each heater is mounted to an XYZ linear stage. Deionized water (DI) was used as the working fluid, and a commercially available pin-fin heat sink was used to run the initial steady-state tests on the experimental rig. The tests showed...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111804
... fluids to reduce the operational and cooling costs by enhancing the thermal management of servers. In this study, heat sinks with TPMS lattice structures were designed for application in singlephase immersion cooling of data center servers. These designs are made possible by Electrochemical Additive...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97481
... Abstract Traditional air-cooling along with corresponding heat sinks are beginning to reach performance limits, requiring lower air-supply temperatures and higher air-supply flowrates, in order to meet the rising thermal management requirements of high power-density electronics. A switch from...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97476
... Abstract This study focuses on a topology-based design approach that can be applied to liquid-cooled heat sinks for high-heat-flux devices with the goal of improving heat dissipation and manufacturability. Specifically, the study investigates the use of additively manufactured topology-based...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97446
... specifically, SiC/Si-IGBT hybrid inverter systems requiring enhanced cooling. Experimental test for this heat sink device consists of flow loop tests through conventional hot plates with a first-generation heat sink device attached. This heat spreading device consists of an internal manifold design...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74010
... Abstract This article conceptualizes a single-phase microchannel heat sink for thermal management of concentrated photovoltaic cells; details of the model-based parametric study that is carried out on the heat sink is also detailed in this article. The heat sink consists of multiple serpentine...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2562
... of Mechanical Engineering, SUNY Polytechnic Institute, Utica, NY, USA ABSTRACT This work presents a simplified approach to optimally designing a heat sink with metallic thermal conductivity enhancers infiltrated with phase change material for electronic cooling. In present study, thermal conductivity enhancers...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2532
... production of complex heat transfer devices previously impossible to traditionally manufacture. This paper introduces three novel prototypes, originally designed for a prior ASME Student Heat Sink Design Competition sponsored by the K-16 (Heat Transfer in Electronic Devices) technical committee...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A035, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73179
... (60W, 75W and 100W) without resorting to Compact Fluorescent (CFL) bulbs containing mercury while maintaining the standard industry bulb size and shape referred to as A19. For many bulb designs, this A19 size and shape restriction forces a small heat sink which is barely capable of dissipating heat...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 769-776, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89111
... with heat sink/fan structure for device efficient operation under constant powering. The study provides meaningful understanding and prediction of a transient powering scenario at high powering levels, evaluating the impact of alternative cooling fan/heat pipe configurations on the thermal performance...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 963-972, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89310
..., such as processor, chipset, memory and power supply etc., are built into one board. In the paper, cooling technologies for the single board computer module are investigated and developed, focusing on natural air heat convection from heat sink to ambient and heat conduction from board to heat sink. Based on thermal...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 445-450, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73293
... for facilitating the introduction of liquid-cooling systems for future low-profile servers.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference . microprocessor cooling heat sink fan blower air cooling cold plate liquid cooling...
Topics: Cooling
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 245-252, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73181
... 03 04 2009 There is growing interest in the use of polymer composites with enhanced thermal conductivity for high performance fin arrays and heat sinks. However, the thermal conductivity of these materials is relatively low compared to conventional fin metals, and strongly orthotropic...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 553-556, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73393
... heat pipe heat sink microprocessor heat removal A simplified theoretical model predicting the heat transfer performance of a heat sink base embedded with a flat heat pipe is developed. Numerical analysis was performed using the commercial software FLUENT. The investigation indicates...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 221-227, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35102
... In this work, some simple air-cooled high-effectiveness heat sinks are proposed for the cooling of electronic devices such as microprocessors for personal computers. The performance of the heat sinks are experimentally investigated. In particular the temperature of the heat sink surface...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 97-102, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35041
... Feasibility study on alternative cooling methods to air-cooling with heat sinks is provided in this paper. The study focuses on cooling of 64-bit microprocessor at 80nm technology node with projected heat dissipation of 200W. An example was presented to illustrate limitation of air-cooling...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 111-117, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35055
..., the development of a LED-based spot module heat sink in a free convective cooling system is discussed. The rationale for choosing a cylindrical tube, longitudinal fin (CTLF) heat sink is shown, as is the performance of five different configurations of the heat sink in various orientations. The requirement...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 63-71, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35018
... An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performances such as local temperature distributions and isotherms on heat spreader surfaces...