... Abstract High-performance heat sinks are required for next-generation battery chargers to manage their ever-increasing power density. For chargers at the now upwards-shifted lower end of the power density spectrum, manufacturers still favor naturally-cooled heat sinks for their low cost...

... 07 01 2011 As the power dissipated by advanced microelectronic devices continues to increase, the demand for reliability also increases. This increases the requirements on the thermal performance of every part of the system, including the heat sink. One of the objectives of this study...

... the areas of concern from a process and reliability stand point. Processes were developed to mitigate the occurrence and severity mte of the identified failure modes. The assembly of heat sinks on these modules is a unique aspect and required special tools and fixtures. Various issues Uut were critical...

... amplitude. For an actuator power consumption of 31 mW, the heat source temperature was lowered by more than 25°C compared to natural convection conditions (for a 2.45 W heater power dissipation). Performance comparisons against axial fans and natural convection heat sinks show that the piezo actuators...

... 03 04 2009 Plate fin heat sinks are commonly used in electronics cooling including high end processors. A number of empirical and analytical methods are available to predict their performance but most of the models are valid for fin pitch larger than 3 mm heat sinks in laminar flow...

... Pool boiling from a surface featuring micro-pyramidal re-entrant cavities (mouth size 40 μm) etched in silicon, on a glass substrate, was studied. All experiments were conducted in the dielectric fluid FC-72 at one atmosphere. The heat sink is designed to eliminate spreading through...

... In this work, some simple air-cooled high-effectiveness heat sinks are proposed for the cooling of electronic devices such as microprocessors for personal computers. The performance of the heat sinks are experimentally investigated. In particular the temperature of the heat sink surface...