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Keywords: heat sinks
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-98077
... Abstract High-performance heat sinks are required for next-generation battery chargers to manage their ever-increasing power density. For chargers at the now upwards-shifted lower end of the power density spectrum, manufacturers still favor naturally-cooled heat sinks for their low cost...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 273-282, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89076
... 07 01 2011 As the power dissipated by advanced microelectronic devices continues to increase, the demand for reliability also increases. This increases the requirements on the thermal performance of every part of the system, including the heat sink. One of the objectives of this study...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 917-922, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33678
... and Effects Analysis (FMEA) was conducted to highlight the areas of concern from a process and reliability stand point. Processes were developed to mitigate the occurrence and severity rate of the identified failure modes. The assembly of heat sinks on these modules is a unique aspect and required special...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 439-443, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73288
... amplitude. For an actuator power consumption of 31 mW, the heat source temperature was lowered by more than 25°C compared to natural convection conditions (for a 2.45 W heater power dissipation). Performance comparisons against axial fans and natural convection heat sinks show that the piezo actuators...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 189-195, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73128
... 03 04 2009 Plate fin heat sinks are commonly used in electronics cooling including high end processors. A number of empirical and analytical methods are available to predict their performance but most of the models are valid for fin pitch larger than 3 mm heat sinks in laminar flow...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 221-227, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35102
... In this work, some simple air-cooled high-effectiveness heat sinks are proposed for the cooling of electronic devices such as microprocessors for personal computers. The performance of the heat sinks are experimentally investigated. In particular the temperature of the heat sink surface...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 575-585, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35267
... Pool boiling from a surface featuring micro-pyramidal re-entrant cavities (mouth size 40 μm) etched in silicon, on a glass substrate, was studied. All experiments were conducted in the dielectric fluid FC-72 at one atmosphere. The heat sink is designed to eliminate spreading through...