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Keywords: high strain rate testing
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97438
... Aging Up to 90 Days , Journal of Electronic Packaging, Vol. 144(2), 2022. [28] Lall, P.; Mehta, V.; Suhling, J.; and Blecker, K., Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging , Proceedings of the ASME 2021...