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Keywords: interfacial delamination
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Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Paper No: IPACK2022-97440
DOI: https://doi.org/10.1115/IPACK2022-97440
... for 15 days, 30 days, 45 days, 60 days, 90 days, and 120 days at temperatures of 100°C, and 150°C. Tests were conducted to determine interfacial delamination of the sample specimen and identify the critical steady-state energy release rates. A digital image correlation approach was also employed...
View Paper titled, Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging
Click here to open pdf in another window PDF for Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging
Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress
Proceedings Papers

Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Paper No: IPACK2021-74062
DOI: https://doi.org/10.1115/IPACK2021-74062
... conditions like moisture. Potting is one of the cost-effective and viable way to improve the survivability of the electronic components. On dynamic shock loading, interfacial delamination occurs between the potting material and the PCB, which further propagates to solder interconnect failures...
View Paper titled, Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
Click here to open pdf in another window PDF for Evolution of Potting-PCB Interfacial Reliability After Long Term High Temperature Operation
Topics: Delamination, Epoxy adhesives, Epoxy resins, Fracture toughness, High temperature, Reliability, Shock (Mechanics), Stress, Fracture (Materials), Electronic components
Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Paper No: IPACK2020-2676
DOI: https://doi.org/10.1115/IPACK2020-2676
... of 10 days, 30 days, 60 days at temperatures ranging from 100°C to 150°C. Quasi-static bending was used to observe and determine interfacial delamination of the sample specimen. A 2D-Digital Image Correlation (DIC) method was also employed to understand the Crack tip opening displacement (CTOD), crack...
View Paper titled, Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
Click here to open pdf in another window PDF for Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging
Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)