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Keywords: interfacial delamination
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
.... The interfacial delamination is a significant reliability issue. However, there is insufficient information on plastic encapsulated electronic components capable of surviving high temperatures for long periods (>100,000 hours). In this paper, we assess the reliability and stability of grounded lid FCBGA. Thermal...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97440
... for 15 days, 30 days, 45 days, 60 days, 90 days, and 120 days at temperatures of 100°C, and 150°C. Tests were conducted to determine interfacial delamination of the sample specimen and identify the critical steady-state energy release rates. A digital image correlation approach was also employed...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A018, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74062
... conditions like moisture. Potting is one of the cost-effective and viable way to improve the survivability of the electronic components. On dynamic shock loading, interfacial delamination occurs between the potting material and the PCB, which further propagates to solder interconnect failures...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2676
... the interface and thermally aged for periods of 10 days, 30 days, 60 days at temperatures ranging from 100°C to 150°C. Quasi-static bending was used to observe and determine interfacial delamination of the sample specimen. A 2D-Digital Image Correlation (DIC) method was also employed to understand the Crack tip...