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Keywords: optoelectronic
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Proceedings Papers
Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 25–27, 2022
Paper No: IPACK2022-97455
... testing, and High Temperature Storage (HTS) will be discussed. Characterization and construction analysis of the package, and model and data comparison with traditional packages will be presented. optoelectronic co-packaging bond and assembly thermomechanical Proceedings of the ASME 2022...
