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Keywords: passive cooling
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111964
... for each package. Passive cooling architectures are beneficial complimentary systems because they can provide thermal gradient mitigation without requiring input power to operate. Phase change materials are one such technology that use their phase transitions to absorb and store thermal energy while...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A007, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111825
... electric vehicle battery thermal management virtual testbed battery life passive cooling active cooling preconditioning Abstract A virtual testbed simulation framework is created for the economical and reliability analysis of battery thermal management control strategies in electric...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A020, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97729
... units. The results show that the thermosyphon can effectively cool both processing units without instabilities. Moreover, the thermosyphon system can operate safely even when one of the two evaporators is not working. Keyboards electronics cooling, passive cooling, two-phase heat transfer, thermosyphon...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97399
... passive cooling PCM nanoparticles thermal conductivity melt front Abstract Passive cooling techniques are widely sought-after solutions to thermal management issues in high power electronics due to increased energy dissipation in reduced areas. Phase change materials (PCMs) present...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6385
... Abstract Metallic phase change materials (mPCMs) have been demonstrated as potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing the thermal resistance between the device and the cooling system...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 363-374, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35169
... materials transient power dissipation electronics cooling passive cooling InterPACK 03: cons enha and dime of th therm are v are s supp phas copp chan appl Key mate pass NOM As Bi b Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6-11, 2003, Maui...