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Keywords: power electronics
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Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 26–28, 2021
Paper No: IPACK2021-69511
... to the existing grid requires the available materials providing thermal conductivities of 6.5 and widespread implementation of decentralized points of power 8.0 W/m-K. HALT specimen were prepared by applying TIM generation. Broadly, utilizing power electronics modules through a 4-mil stencil over AlSiC baseplates...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Paper No: IPACK2020-2606
...Abstract Abstract The increasing demand for high power density wide-bandgap power electronics has propelled heat transfer research leading to a constant increase in the thermal performance of cold plates and heat sinks. Most of this research has focused on reducing thermal resistance...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Paper No: IPACK2019-6631
... for the converter design ranging from the die level up to the full system with 36 submodules. The modeling results were validated against experimental data from system tests performed by OSU. power electronics thermal modeling porous media model simplification effectiveness-NTU MULTI-SCALE THERMAL...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
... for electric vehicle power electronics. Metal foams have a high specific surface area, high thermal conductivity, and low relative density, which makes them excellent for heat transfer applications as demonstrated extensively in prior literature. Additionally, additive manufacturing offers the ability to print...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Paper No: IPACK2019-6440
... Abstract Researchers have been extensively studying wide-bandgap (WBG) semiconductor materials such as gallium nitride (GaN) with an aim to accomplish an improvement in size, weight, and power (SWaP) of power electronics beyond current devices based on silicon (Si). However, the increased...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
... Abstract Thermal management of high-power electronics is often a major obstacle in achieving improved packaging density. Emergence of SiC devices allows higher voltage and temperature limits, but thermal management is still a bottleneck in achieving compact, reliable and high-performance...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A017, October 7–9, 2019
Paper No: IPACK2019-6453
... Abstract Gallium oxide is an emerging wide band-gap material that has the potential to penetrate the power electronics market in the near future. In this paper, a finite-element gallium oxide semiconductor model is presented that can predict the electrical and thermal characteristics...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 577-589, July 17–22, 2005
Paper No: IPACK2005-73407
... jet impingement as an option for cooling power electronics components. The main purpose of this paper is to compare the different single-phase jet impingement configurations, which have been reported in the literature, primarily from a heat transfer viewpoint. The discussion is also from the viewpoint...
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 425-430, July 17–22, 2005
Paper No: IPACK2005-73284
... system to actively cool the electronic components populating a Printed Circuit Board in High-Power Microelectronics System. The proposed system includes several miniaturized components — compressor, evaporator, condenser — part of a refrigeration system designed to fit the smaller scale power electronics...