... the turbulence generated caused by fluid entrainment due to differences in initial velocity profiles and location of secondary stagnation points. Regarding high power electronics with integrated jet impingement schemes, turbulence and heat transfer rates must be optimized to meet the extreme cooling requirements...

...) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance. jet impingement power electronics thermal management wide bandgap Proceedings of the ASME 2022 International Technical Conference and Exhibition...

... Abstract With the rapid growth of electric vehicles and hybrid electric vehicles, rigorous design targets in terms of cost, efficiency, and power density have been set for automotive power electronics. Novel power module and inverter technologies based on wide-bandgap semiconductors have been...

... in the shape of those used in Wolfspeed CAS325M12HM2 power electronics modules. Baseplates were mounted onto aluminum carrier blocks with embedded thermocouples to characterize the thermal resistance across the baseplate and TIM layer. Thermal dissipation into the top of the baseplates was provided by a custom...

... Abstract The increasing demand for high power density wide-bandgap power electronics has propelled heat transfer research leading to a constant increase in the thermal performance of cold plates and heat sinks. Most of this research has focused on reducing thermal resistance of the package...

... for the converter design ranging from the die level up to the full system with 36 submodules. The modeling results were validated against experimental data from system tests performed by OSU. power electronics thermal modeling porous media model simplification effectiveness-NTU MULTI-SCALE THERMAL...

... for electric vehicle power electronics. Metal foams have a high specific surface area, high thermal conductivity, and low relative density, which makes them excellent for heat transfer applications as demonstrated extensively in prior literature. Additionally, additive manufacturing offers the ability to print...

... Abstract Researchers have been extensively studying wide-bandgap (WBG) semiconductor materials such as gallium nitride (GaN) with an aim to accomplish an improvement in size, weight, and power (SWaP) of power electronics beyond current devices based on silicon (Si). However, the increased...

... Abstract Thermal management of high-power electronics is often a major obstacle in achieving improved packaging density. Emergence of SiC devices allows higher voltage and temperature limits, but thermal management is still a bottleneck in achieving compact, reliable and high-performance...

... Abstract Gallium oxide is an emerging wide band-gap material that has the potential to penetrate the power electronics market in the near future. In this paper, a finite-element gallium oxide semiconductor model is presented that can predict the electrical and thermal characteristics...

... industry in exploring jet impingement as an option for cooling power electronics components. The main purpose of this paper is to compare the different single-phase jet impingement configurations, which have been reported in the literature, primarily from a heat transfer viewpoint. The discussion is also...

... scale power electronics. The system is thermally optimized to reach high COP (Coefficients of Performance). An array of micro-channels is used for the evaporator/condenser units. A previous study indicated that the R-134s refrigerant provides the best COP/feasibility ratio, while being the most suitable...