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Keywords: reliability
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Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112060
... electronics, gravure offset printing, thermoforming, PETG, PC, reliability, additive printing NOMENCLATURE ECA Electrically conductive adhesive FWR Full wave rectifier HDT Heat deflection temperature IME In-mold electronics PC Polycarbonate PETG Polyethylene glycol terephthalate R/L Resistance per unit length...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110576
...Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2023 October 24-26, 2023, San Diego, California IPACK2023-110576 Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A015, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-113208
... and thermal connections for high junction temperatures. However, sintered silver bond-lines are porous, typically containing 15% to 20% volume fraction. This study aims to investigate the effects of these pores on the mechanical reliability of the bond-line. The simulations were conducted using ANSYS software...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97338
... on test vehicle simulations: electrical-diffusion, electrical-thermal-diffusion and structural-thermal-electric-diffusion. The results of EM behavior as well as the computational time are compared. electromigration finite element analysis multiphysics atomic flux divergence reliability...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A015, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97614
... Abstract One of the most important elements for market acceptance of new technologies is ensuring reliability. Nowhere is this truer than in the shift from well characterized fossil fuel technologies to newer renewable and sustainable energy technologies. The key enabling technology driving...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97204
... of the chips on the Chiplet module caused any reliability concern. A risk factor was calculated to determine if the power magnitude of the die is within the safe region. With risk factors, we will be able to quantify the differences of applied powers with respect to the maximum allowed limits. We have expanded...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74060
... applications in FHE devices. flexible encapsulants interfacial strength liquid encapsulation reliability flexible hybrid electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A025, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74199
... of Ag pad. The solder joint mechanical integrity was evaluated by solder ball shear test. High temperature storage test was also carried out to evaluate the solder joint reliability. Experiment results showed that Ag pad fabricated by AM is SMT compatible. High temperature storage did not cause early...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73367
... possess a higher melting point than the low temperature semimetal. The paper will demonstrate the use of this technique to make reliable 2D lines and 3D structures. It will also discuss the deposition and sintering process and its effect on the adhesion strength, thermal conductivity, and electrical...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2647
.... With the advancements in portable and densely packaged electronics, thin power sources, which are reliable and are needed to sustain the daily stresses of motion. The ability of thin form factors to operate reliably in presence of loads such twisting while simultaneously being exposed to different ambient temperatures...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2547
... for the challenges of on substrate process and reliability, meanwhile simulation is performed for stress prediction. In addition, possible solutions from material and process are discussed and studied. HPC data center cloud computing chip module UF encapsulation reliability HIGH PERFORMANCE COMPUTING...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A010, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2596
... Abstract Electronics packaging development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical strains occur because of the coefficient of thermal expansion mismatch from different conjoined...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6579
... Abstract Additively Printed Flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the location of use. There is a dearth of standards for testing and reliability assurance of flexible electronics and reliability data for various...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6568
... Abstract Immersion cooling is highly efficient thermal management technique and can potentially be used for thermal management of high-density data. However, to use this as a viable cooling technique, the effect of dielectric coolants on the reliability of server components needs...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A019, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73287
... to thermal aging. The proposed method can be used for equivalency of damage accrued in Cu-Al parts subjected to multiple thermal aging environments. Cu-Al wire bond Intermetallic layer Reliability Leading indicators Prognostication Health Management LEADING INDICATORS FOR PROGNOSTICATION...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 609-615, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52260
... 15 02 2012 Flip Chip (FC) technology has now become the mainstream solution for high performance packages. From commercial gaming machines to high reliability servers, the FC package is gaining more market share over traditional packaging technologies, such as wire bond. Extensive...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 75-82, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52264
... 15 02 2012 A thermo-mechanical analysis is carried out on a stacked die package having through silicon via technology to study the overall reliability of the package due to varying aspect ratio (size and shape) of through silicon vias, silicon die thickness, underfill thickness...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89209
... 07 01 2011 In this work, the effects of underfill cure temperature and JEDEC MSL preconditioning on underfill mechanical and strength properties, as well as flip chip assembly reliability have been explored. Baseline stress-strain curves, mechanical properties, and interfacial shear...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 921-927, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89337
... The LED issues, associated with high cost, high junction temperature, low luminous efficiency, and low reliability, have to be solved before gaining more market penetration. With special features of low-junction-temperature and low-cost design, COP (Chip-on-Plate) LED package modules...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 267-276, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89223
... and, as such, it is particularly useful for development of MEMS , especially while considering MEMS reliability assessment. In fact, this methodology is being used in various manufacturing stages of MEMS for high-performance applications . MEMS emerging technologies optoelectronic methodology operating conditions...