... of the chips on the Chiplet module caused any reliability concern. A risk factor was calculated to determine if the power magnitude of the die is within the safe region. With risk factors, we will be able to quantify the differences of applied powers with respect to the maximum allowed limits. We have expanded...

... Abstract One of the most important elements for market acceptance of new technologies is ensuring reliability. Nowhere is this truer than in the shift from well characterized fossil fuel technologies to newer renewable and sustainable energy technologies. The key enabling technology driving...

... on test vehicle simulations: electrical-diffusion, electrical-thermal-diffusion and structural-thermal-electric-diffusion. The results of EM behavior as well as the computational time are compared. electromigration finite element analysis multiphysics atomic flux divergence reliability...

... applications in FHE devices. flexible encapsulants interfacial strength liquid encapsulation reliability flexible hybrid electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2021...

... of Ag pad. The solder joint mechanical integrity was evaluated by solder ball shear test. High temperature storage test was also carried out to evaluate the solder joint reliability. Experiment results showed that Ag pad fabricated by AM is SMT compatible. High temperature storage did not cause early...

... possess a higher melting point than the low temperature semimetal. The paper will demonstrate the use of this technique to make reliable 2D lines and 3D structures. It will also discuss the deposition and sintering process and its effect on the adhesion strength, thermal conductivity, and electrical...

.... With the advancements in portable and densely packaged electronics, thin power sources, which are reliable and are needed to sustain the daily stresses of motion. The ability of thin form factors to operate reliably in presence of loads such twisting while simultaneously being exposed to different ambient temperatures...

... for the challenges of on substrate process and reliability, meanwhile simulation is performed for stress prediction. In addition, possible solutions from material and process are discussed and studied. HPC data center cloud computing chip module UF encapsulation reliability HIGH PERFORMANCE COMPUTING...

... Abstract Electronics packaging development is greatly dependent on the magnitude of interconnect and on-chip stress that ultimately limits the reliability of electronic components. Thermomechanical strains occur because of the coefficient of thermal expansion mismatch from different conjoined...

... Abstract Additively Printed Flexible electronics in wearable application may be subjected to twisting or flexing depending on the form factor and the location of use. There is a dearth of standards for testing and reliability assurance of flexible electronics and reliability data for various...

... Abstract Immersion cooling is highly efficient thermal management technique and can potentially be used for thermal management of high-density data. However, to use this as a viable cooling technique, the effect of dielectric coolants on the reliability of server components needs...

... to thermal aging. The proposed method can be used for equivalency of damage accrued in Cu-Al parts subjected to multiple thermal aging environments. Cu-Al wire bond Intermetallic layer Reliability Leading indicators Prognostication Health Management LEADING INDICATORS FOR PROGNOSTICATION...

... 1 Copyright © 2011 by ASME Proceedings of IPACK2011 ASME InterPACK '11 July 6-8, 2011, Portland, Oregon IPACK2011-52260 Lead Free Flip Chip Reliability for Various Package Types Nokibul Islam Amkor Technology Inc, 1900 South Price Road, Chandler, AZ, 85286, USA Tel: 480-786-7730, Fax: 480-821-2389...

... 15 02 2012 A thermo-mechanical analysis is carried out on a stacked die package having through silicon via technology to study the overall reliability of the package due to varying aspect ratio (size and shape) of through silicon vias, silicon die thickness, underfill thickness...

... 07 01 2011 In this work, the effects of underfill cure temperature and JEDEC MSL preconditioning on underfill mechanical and strength properties, as well as flip chip assembly reliability have been explored. Baseline stress-strain curves, mechanical properties, and interfacial shear...

... The LED issues, associated with high cost, high junction temperature, low luminous efficiency, and low reliability, have to be solved before gaining more market penetration. With special features of low-junction-temperature and low-cost design, COP (Chip-on-Plate) LED package modules...

... is illustrated by use of selected MEMS samples. The representative results presented in this paper indicate that the optical methodology is a viable tool for micro-scale measurements and, as such, it is particularly useful for development of MEMS, especially while considering MEMS reliability assessment. In fact...

... 12 01 2010 The built-in stress test (BIST) is extensively used for diagnostics or identification of failure. The current version of BIST approach is focused on reactive failure detection and provides limited insight into reliability and residual life. A new approach has been developed...

... a billion. All of the above has necessitated considerable improvement in cooling technology and associated reliability. Heat sinks play an important role in cooling technology by providing an increased surface area to dissipate heat. While there has been a great deal of work related to the thermal...

... 12 01 2010 Methodologies for prognostication and health monitoring can significantly impact electronic reliability for applications in which even minimal risk of failure may be unbearable. Presently, health monitoring approaches such as the built-in self-test (BIST) are based...