1-9 of 9
Keywords: thermal aging
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111937
... model of the FCBGA interfaces has been created. underfill materials Paris law isothermal exposure underfill/chip interface FCBGA delamination bi-material fracture interfacial fracture toughness thermal aging Proceedings of the ASME 2023 International Technical Conference and Exhibition...
Proceedings Papers

Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A014, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112070
... that some of the properties of fatigue crack propagation can be determined from a bi-material interfaces monotonic fracture behavior. interfacial delamination interfacial fracture TIM-lid interface interfacial crack bending load fatigue loading fracture toughness thermal aging Paris law FCBGA...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97452
... temperatures (-65°C to 0°C) at high strain rate after varied thermal aging periods up to one year. In addition, the evolution of Anand parameters for SAC solder alloys after prolonged thermal aging has been studied. The Anand model s reliability has been assessed by comparing experimentally observed data...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97427
.... isothermal exposure thermal aging cohesive zone modeling interfacial fracture toughness delamination epoxy/PCB interface delamination potting compounds Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97424
... loading. isothermal exposure FCBGA thermal aging interfacial fracture toughness delamination chip/underfill Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25-27, 2022...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74068
.... The computed 9 anand parameters were used to verify the accuracy of the Anand model. A good correlation was found between experimental data and Anand predicted data. high strain rate doped solders SAC105 SAC-Q thermal aging Anand viscoplastic model Proceedings of the ASME 2021 International...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2658
... predicted data. high strain rate SAC105 SAC-Q thermal aging Anand viscoplastic model EVOLUTION OF ANAND PARAMETERS WITH ELEVATED TEMPERATURE AGING FOR SAC LEADFREE ALLOYS Pradeep Lall1, Vikas Yadav1, Jeff Suhling1 1Auburn University, NSF-CAVE3 Electronics Research Center, Department...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6521
... the reliability issues found in electronic packages. This current investigation deals with the review of mechanical property degradations of SAC305(Sn-96.5Ag-3.0Cu-0.5) solder materials due to thermal aging and their effects on electromigration oriented failure of small scale flip chip solder bumps. Thermal aging...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6577
.... Temperatures in these applications can exceed 200°C, which is closed to melting point for SAC alloys. The microstructure for lead free solder alloys constantly evolves when subjected to thermal aging for sustained periods with accompanying degradation in mechanical properties of solder alloys. In this paper...