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1-20 of 36
Keywords: thermal management
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Proceedings Papers
Ali Heydari, Yaman Manaserh, Ahmad Abubakar, Carol Caceres, Harold Miyamura, Alfonso Ortega, Jeremy Rodriguez
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 25–27, 2022
Paper No: IPACK2022-97047
...-phase cooling efficiency thermal management refrigeration Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2022 October 25-27, 2022, Garden Grove, California IPACK2022-97047 DIRECT-TO-CHIP...
Proceedings Papers
Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 25–27, 2022
Paper No: IPACK2022-97481
... Abstract Traditional air-cooling along with corresponding heat sinks are beginning to reach performance limits, requiring lower air-supply temperatures and higher air-supply flowrates, in order to meet the rising thermal management requirements of high power-density electronics. A switch from...
Proceedings Papers
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A010, October 25–27, 2022
Paper No: IPACK2022-98077
... orientation’s average wall temperature by about 2%. Our future work will look to gather experimental data for the specified heat sinks and boundary conditions. thermal management natural convection battery chargers heat sinks segmented fins inclined fins pin fins Proceedings of the ASME 2022...
Proceedings Papers
Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A003, October 25–27, 2022
Paper No: IPACK2022-97283
...) for the design. The thermal resistance of the module design is about 67% lower than the 2015 BMW i3 power electronics/modules thermal resistance. jet impingement power electronics thermal management wide bandgap Proceedings of the ASME 2022 International Technical Conference and Exhibition...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 26–28, 2021
Paper No: IPACK2021-70410
... structure without modifying the thermal conductivity of copper. open-cell copper metal foam WP model effective thermal conductivity thermal management ECU cooling Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A002, October 26–28, 2021
Paper No: IPACK2021-74010
... Abstract This article conceptualizes a single-phase microchannel heat sink for thermal management of concentrated photovoltaic cells; details of the model-based parametric study that is carried out on the heat sink is also detailed in this article. The heat sink consists of multiple serpentine...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A002, October 26–28, 2021
Paper No: IPACK2021-69254
... pastes at a significantly lower cost. We also expect similar benefits for the silicone-based thermal pastes. electronics cooling thermal interface material thermal management electronics packaging graphene thermal conductance Proceedings of the ASME 2021 International Technical Conference...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A009, October 26–28, 2021
Paper No: IPACK2021-73287
... in aviation systems. Environmental conditions will play a large role in the design space and limitations of potential cooling solutions and will dictate the effectiveness of current thermal management systems. In arising scenarios where high-density electronics cannot be contained within a pressurized...
Proceedings Papers
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 26–28, 2021
Paper No: IPACK2021-69321
... PCM PT-58 and the experimental data with a 2W heater. PCMs phase change energy total heat design tool index parameter thermal management pulse electronics Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic...
Proceedings Papers
Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 27–29, 2020
Paper No: IPACK2020-2550
... Abstract One of the key challenges for the electric vehicle industry is to develop high-power-density electric motors. Achieving higher power density requires efficient heat removal from inside the motor. In order to improve thermal management, a multi-physics modeling framework that is able...
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 27–29, 2020
Paper No: IPACK2020-2609
... safety record. thermal management Li-ion battery simulation digital twin electric vehicle reduced order model REAL TIME PREDICTION OF LI-ION BATTERY PACK TEMPERATURES IN EV VEHICLES Azita Soleymani, William Maltz Electronic Cooling Solutions, Inc. Santa Clara, CA, USA ABSTRACT A semi...
Proceedings Papers
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A010, October 27–29, 2020
Paper No: IPACK2020-2670
... 300 W per GPU in an immersion cooling solution. immersion cooling dielectric fluid single phase thermal management EVALUATION OF SINGLE PHASE IMMERSION COOLING SYSTEM FOR HIGH PERFORMANCE SERVER CHASSIS USING DIELECTRIC COOLANTS Shuai Shao1, Tianyi Gao1, Huawei Yang1, Jie Zhao2, Jiajun...
Proceedings Papers
Bidzina Kekelia, Kevin Bennion, Xuhui Feng, Gilberto Moreno, J. Emily Cousineau, Sreekant Narumanchi, Jeff Tomerlin
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A004, October 7–9, 2019
Paper No: IPACK2019-6457
... increased heat transfer coefficients, namely, increasing surface temperature from 90°C to 120°C enhanced heat transfer coefficient values at higher impinged jet velocities (7.5 m/s) by up to 15%. jet impingement automatic transmission fluid electric machines electric motors thermal management...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A023, October 7–9, 2019
Paper No: IPACK2019-6519
... in volume. To fully take advantage of the benefits offered by these devices, the packaging, including cooling infrastructure, must also be addressed. Additive manufactured (AM) structures, based on unit cells seen in stochastic foams, have been investigated as an improvement in thermal management...
Proceedings Papers
James Spencer Lundh, Yiwen Song, Bikram Chatterjee, Albert G. Baca, Robert J. Kaplar, Andrew M. Armstrong, Andrew A. Allerman, Hyungtak Kim, Sukwon Choi
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A014, October 7–9, 2019
Paper No: IPACK2019-6440
... self-heating thermal dynamics thermal management thermoreflectance thermal imaging wide bandgap (WBG) INTEGRATED OPTICAL PROBING OF THE THERMAL DYNAMICS OF WIDE BANDGAP POWER ELECTRONICS James Spencer Lundh1, Yiwen Song1, Bikram Chatterjee1, Albert G. Baca2, Robert J. Kaplar2, Andrew M...
Proceedings Papers
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 7–9, 2019
Paper No: IPACK2019-6594
... Abstract Temperature critically affects the performance, life and safety of lithium-ion batteries. Therefore, it is essential to understand heat generation and dissipation within individual battery cells and battery packs to plan a proper thermal management strategy. One of the key challenges...
Proceedings Papers
Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi, Shiladri Chakraborty, Yongwan Park, He Yun, Alireza Khaligh, Lauren Boteler, Miguel Hinojosa
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A026, October 7–9, 2019
Paper No: IPACK2019-6559
... Abstract Thermal management of high-power electronics is often a major obstacle in achieving improved packaging density. Emergence of SiC devices allows higher voltage and temperature limits, but thermal management is still a bottleneck in achieving compact, reliable and high-performance...
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A004, July 16–18, 2013
Paper No: IPACK2013-73166
.... Compared to other technologies such as System-on-Chip (SoC) or System-in-Package (SiP), interposer-based integration offers several technological advantages. However, the thermal management of an interposer-based system is not well understood. The presence of multiple heat sources in various die...
Proceedings Papers
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A002, July 16–18, 2013
Paper No: IPACK2013-73031
... abatement techniques for local hot spots while keeping light extraction at maximum. Light emitting diodes LEDs Liquid cooling thermal management electronics cooling design optimization DIRECT LIQUID COOLING OF HIGH FLUX LED SYSTEMS: HOT SPOT ABATEMENT Enes Tamdogan*, Mehmet Arik and M. Baris...
Proceedings Papers
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 147-158, July 19–23, 2009
Paper No: InterPACK2009-89289
... hot spots with heat fluxes approaching and at times exceeding 1 kW/cm2. The cost-effective thermal management of such chips requires the introduction and refinement of novel cooling techniques. Mini-contact enhanced, miniaturized thermoelectric coolers (TECs) have been shown to be a viable...
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