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Keywords: thermal modeling
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Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019
Paper No: IPACK2019-6631
... Abstract This paper describes a multi-scale thermal analysis approach for the design of an air-cooled 1.7-kV SiC MOSFET-based medium-voltage variable-speed motor drive. The scope of the models and required efficient and flexible thermal models to be developed. Two modeling techniques...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 95-101, July 19–23, 2009
Paper No: InterPACK2009-89017
... integrated circuits. 3D integrated circuits floorplanning thermal modeling electrical design wafer-on-wafer bonding Proceedings of IPACK-2009 InterPACK 09 July 19-23, 2009, San Francisco, California, USA IPACK2009-89017 THERMAL-ELECTRICAL CO-OPTIMIZATION OF BLOCK-LEVEL FLOORPLANNING IN 3D...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 575-583, July 6–11, 2003
Paper No: IPACK2003-35334
... There is a strong need to improve our current capabilities in thermal management and electronic cooling, since estimates indicate that IC power density level could reach 50 W/cm 2 in near future. This paper presents an innovative approach for thermal modeling of active cooling schemes suitable...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 201-206, July 6–11, 2003
Paper No: IPACK2003-35092
... technique to model the thermal vias by a block can lead to appreciable errors in predicting the die temperature. IC packages thermal vias thermal modeling BGA Proceedings of InterPACK 2003 Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6-11...