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Keywords: transient
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 25–27, 2022
Paper No: IPACK2022-97425
... methods to dissipate the high heat fluxes of modern high-power CPUs and GPUs. While the published literature has well-documented research on the thermal aspects of direct liquid cooling, a detailed account of transient hydraulic investigation is still missing. In this experiment, a total of four 52U racks...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A013, October 27–29, 2020
Paper No: IPACK2020-2606
... which can have a detrimental effect on transient thermal performance if thermal capacitance is reduced. In order to provide both a low thermal resistance and a higher thermal capacitance integrated into the package and near the thermal junction, a new cold plate called the Package Integrated Cyclone...
Proceedings Papers

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A038, July 16–18, 2013
Paper No: IPACK2013-73186
... scenarios. This paper will present the results of recent work on thermoelectric “self cooling” of transient hotspots. A 3-D multi-physics numerical model is used to simulate the spatial and temporal temperature variations associated with a dynamic hotspot on a germanium substrate, for which the hotspot heat...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 761-767, July 19–23, 2009
Paper No: InterPACK2009-89110
... -1- Proceedings of IPACK2009 ASME InterPACK 09 July 17 21, 2009, San Francisco, California, USA IPACK2009-89110 System Level Transient Thermal Performance of High-Power Dynamic Microelectronics Victor Chiriac Technology Solutions Organization Freescale Semiconductor Inc. 2100 E. Elliot Road...
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 233-239, July 8–12, 2007
Paper No: IPACK2007-33705
... Tom Lee Freescale Semiconductor Inc. Wireless and Packaging Systems Laboratory 2100 East Elliot Road, Tempe, AZ 85284 Tel: (480) 413-6756/5666; Fax: (480) 413-4511 ABSTRACT A detailed transient thermal study for a Remote Keyless Entry System with dynamic heat sources is performed using numerical...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 363-370, July 6–11, 2003
Paper No: IPACK2003-35167
...) and a power package (SILP). Finally, a method is presented to calibrate detailed models using experimental response curves, thereby eliminating the need for the sometimes unreliable and time- consuming steady state measurements. Keywords: compact thermal models, dynamic, time- dependent, transient, thermal...