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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97186
... floormap workload superposition thermal Abstract Thermal considerations are a critical facet in SoC and System design. There are numerous difficulties in performing comprehensive thermal analysis on modern SoC designs as well as considerable difficulty in moving towards a cross...