We present the proof-of-concept for a biomimetic electrospray vapor chamber (BEVAC) which can potentially eliminate the wick structures and thermal interface materials used in conventional vapor chambers, and enable direct cooling of the backside of a microprocessor. This vapor chamber has a beetle-inspired superhydrophobic condenser with hydrophilic bumps on which condensate of the working fluid accumulates. The condensate is returned to the evaporator by electrostatic forces (electrospray atomization). We have demonstrated this novel liquid return mechanism with an open-system BEVAC prototype in which an external voltage is applied between a wickless evaporator and a microfabricated condenser with hybrid wettability.

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