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Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 439-441, December 18–21, 2009
Paper No: MNHMT2009-18498
... We present the proof-of-concept for a biomimetic electrospray vapor chamber (BEVAC) which can potentially eliminate the wick structures and thermal interface materials used in conventional vapor chambers, and enable direct cooling of the backside of a microprocessor. This vapor chamber has...