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Proceedings Papers

Encapsulating and Inkjet-Printing Electronics on Flexible Substrates for Harsh Environment

Sahil Wankhede, Xian Du, Ali Alshehri, Keith Brashler, Doru Turcan

Proc. ASME. IAM2022, 2022 International Additive Manufacturing Conference, V001T03A001, October 19–20, 2022

Paper No: IAM2022-92250

DOI: https://doi.org/10.1115/IAM2022-92250

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Topics: Electronics, Printing

Proceedings Papers

Ultrafast Laser Direct Writing of Conductive Patterns on Polyimide Substrate

Ishrat Jahan Biswas, Enrique Contreras Lopez, Farid Ahmed, Jianzhi Li

Proc. ASME. MSEC2022, Volume 1: Additive Manufacturing; Biomanufacturing; Life Cycle Engineering; Manufacturing Equipment and Automation; Nano/Micro/Meso Manufacturing, V001T07A018, June 27–July 1, 2022

Paper No: MSEC2022-85684

DOI: https://doi.org/10.1115/MSEC2022-85684

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Topics: Electronics, Lasers

Proceedings Papers

Enhancing Conductivity in 3D Bulk-Embedded Electronics

Md. Naim Jahangir, Jeremy Cleeman, Rajiv Malhotra

Proc. ASME. MSEC2020, Volume 2: Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T08A011, September 3, 2020

Paper No: MSEC2020-8361

DOI: https://doi.org/10.1115/MSEC2020-8361

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Topics: Additive manufacturing, Damage, Electrical conductivity, Electronics, Sintering, Thermal conductivity

Proceedings Papers

Packaging Electronics on Textiles: Identifying Fiber Junctions for Automated Placement

Sushmita Challa, Cindy Harnett

Proc. ASME. MSEC2020, Volume 2: Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T09A004, September 3, 2020

Paper No: MSEC2020-8456

DOI: https://doi.org/10.1115/MSEC2020-8456

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Topics: Electronics, Fibers, Image processing, Junctions, Packaging, Textiles

Proceedings Papers

A State-of-the-Art Review on Aerosol Jet Printing (AJP) Additive Manufacturing Process

Roozbeh Ross Salary, Jack P. Lombardi, III, Darshana L. Weerawarne, Prahalad K. Rao, Mark D. Poliks

Proc. ASME. MSEC2019, Volume 1: Additive Manufacturing; Manufacturing Equipment and Systems; Bio and Sustainable Manufacturing, V001T01A035, June 10–14, 2019

Paper No: MSEC2019-3008

DOI: https://doi.org/10.1115/MSEC2019-3008

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Topics: Additive manufacturing, Aerosols, Electronics, Manufacturing, Printing

Proceedings Papers

Microwave-Assisted Processing of Regenerated Silk Fibroin Films

Moataz Abdulhafez, Se Youn Cho, Golnaz Tomaraei, Mostafa Bedewy

Proc. ASME. MSEC2019, Volume 2: Processes; Materials, V002T04A008, June 10–14, 2019

Paper No: MSEC2019-2932

DOI: https://doi.org/10.1115/MSEC2019-2932

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Topics: Microwaves, Irradiation (Radiation exposure), Transparency, Biocompatibility, Biodegradation, Casting, Electronics, Food products, Fourier transform infrared spectroscopy, Fourier transforms

Proceedings Papers

Use of Programmed Piezo Crystal Flexures for Economic Vapor Deposition of Parylene HT ® on Unlimited Lengths of Magnet Wire

Tom M. Lawrence, Marvin D. Kemple

Proc. ASME. MSEC2018, Volume 4: Processes, V004T03A047, June 18–22, 2018

Paper No: MSEC2018-6321

DOI: https://doi.org/10.1115/MSEC2018-6321

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Topics: Crystals, Magnet wire, Vapor deposition, Wire, Coatings, High temperature steam, Cable reels, Electronics, Engineering prototypes, High temperature

Proceedings Papers

Active Control of Fabricating Nanofibrous Wavy/Helical Arrays Using Near-Field Electrospinning

Xiangyu You, Ping Guo

Proc. ASME. MSEC2018, Volume 1: Additive Manufacturing; Bio and Sustainable Manufacturing, V001T01A029, June 18–22, 2018

Paper No: MSEC2018-6609

DOI: https://doi.org/10.1115/MSEC2018-6609

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Topics: Electrospinning, Buckling, Electric fields, Electrodes, Electronics, Kinematics, Nanoscale phenomena, Sensors, Signals, Transducers

Proceedings Papers

Transport and Interfacial Phenomena in Nanoscale Confined Laser Crystallization

Wan Shou, Heng Pan

Proc. ASME. MSEC2017, Volume 3: Manufacturing Equipment and Systems, V003T04A073, June 4–8, 2017

Paper No: MSEC2017-2818

DOI: https://doi.org/10.1115/MSEC2017-2818

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Topics: Crystallization, Interface phenomena, Lasers, Nanoscale phenomena, Electronics, Integrated circuits, Ablation (Vaporization technology), Amorphous materials, Annealing, Crystals

Proceedings Papers

Rapid Intense Pulse Light Sintering of Copper Sulphide Nanoparticle Films

Shalu Bansal, Zhongwei Gao, Chih-hung Chang, Rajiv Malhotra

Proc. ASME. MSEC2017, Volume 1: Processes, V001T02A067, June 4–8, 2017

Paper No: MSEC2017-2739

DOI: https://doi.org/10.1115/MSEC2017-2739

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Topics: Copper, Nanoparticles, Sintering, Thin films, Electrical properties, Coatings, Crystal structure, Electronics, Metals, Semiconductors (Materials)

Proceedings Papers

Design of a Tip Based In-Line Metrology System for Roll-to-Roll Manufactured Flexible Electronic Devices

Liam G. Connolly, Michael Cullinan

Proc. ASME. MSEC2017, Volume 1: Processes, V001T02A068, June 4–8, 2017

Paper No: MSEC2017-2972

DOI: https://doi.org/10.1115/MSEC2017-2972

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Topics: Design, Flexible electronics, Metrology, Atomic force microscopy, Bending (Stress), Finite element analysis, Manufacturing, Resolution (Optics), Electronics, Flaw detection

Proceedings Papers

Active Mixing Nozzle for Multi-Material and Multi-Scale 3D Printing

Hongbo Lan

Proc. ASME. MSEC2017, Volume 2: Additive Manufacturing; Materials, V002T01A024, June 4–8, 2017

Paper No: MSEC2017-2779

DOI: https://doi.org/10.1115/MSEC2017-2779

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Topics: Additive manufacturing, Nozzles, Geometry, Biological tissues, Circuits, Computer simulation, Electrohydrodynamics, Electronics, Functionally graded materials, Metamaterials

Proceedings Papers

Forecasting Obsolescence Risk Using Machine Learning

Connor Jennings, Dazhong Wu, Janis Terpenny

Proc. ASME. MSEC2016, Volume 2: Materials; Biomanufacturing; Properties, Applications and Systems; Sustainable Manufacturing, V002T04A033, June 27–July 1, 2016

Paper No: MSEC2016-8625

DOI: https://doi.org/10.1115/MSEC2016-8625

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Topics: Machine learning, Risk, Bills of materials, Design, Electronics, Innovation, Product design

Proceedings Papers

Fabricating Microchannels in Elastomer Substrates for Stretchable Electronics

Michelle C. Yuen, Rebecca K. Kramer

Proc. ASME. MSEC2016, Volume 2: Materials; Biomanufacturing; Properties, Applications and Systems; Sustainable Manufacturing, V002T01A014, June 27–July 1, 2016

Paper No: MSEC2016-8654

DOI: https://doi.org/10.1115/MSEC2016-8654

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Topics: Elastomers, Electronics, Microchannels, Manufacturing, Flexible electronics, Fluids, Sensors, Additive manufacturing, Electrical resistance, Laser ablation

Proceedings Papers

Agent Based Simulation Optimization of Waste Electrical and Electronics Equipment Recovery

Ardeshir Raihanian Mashhadi, Sara Behdad, Jun Zhuang

Proc. ASME. MSEC2016, Volume 3: Joint MSEC-NAMRC Symposia, V003T08A017, June 27–July 1, 2016

Paper No: MSEC2016-8639

DOI: https://doi.org/10.1115/MSEC2016-8639

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Topics: Electronics, Optimization, Simulation, Cycles, Uncertainty, Data collection, Electronic products, Profitability

Proceedings Papers

Design and Modeling of a Microscale Selective Laser Sintering System

Nilabh Roy, Anil Yuksel, Michael Cullinan

Proc. ASME. MSEC2016, Volume 3: Joint MSEC-NAMRC Symposia, V003T08A002, June 27–July 1, 2016

Paper No: MSEC2016-8569

DOI: https://doi.org/10.1115/MSEC2016-8569

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Topics: Design, Lasers, Microscale devices, Modeling, Sintering, Additive manufacturing, Metals, Heat transfer, Nanoparticles, Nanoscale phenomena

Proceedings Papers

The Leidenfrost Effect at the Nanoscale

Jhonatam Cordeiro, Salil Desai

Proc. ASME. MSEC2016, Volume 1: Processing, V001T02A079, June 27–July 1, 2016

Paper No: MSEC2016-8650

DOI: https://doi.org/10.1115/MSEC2016-8650

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Topics: Film boiling, Nanoscale phenomena, Drops, Nanotechnology, Silicon, Temperature, Biomedicine, Boiling, Computers, Electronics

Proceedings Papers

Process Parameter Studies of Molecular Dynamics Models to Control Substrate Wettability

Jhonatam Cordeiro, Salil Desai

Proc. ASME. MSEC2015, Volume 1: Processing, V001T02A025, June 8–12, 2015

Paper No: MSEC2015-9282

DOI: https://doi.org/10.1115/MSEC2015-9282

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Topics: Molecular dynamics, Nanoscale phenomena, Biomedicine, Computer simulation, Drops, Electronics, Finite element analysis, Geometry, Machinery, Modeling

Proceedings Papers

4D Printing: Design and Fabrication of 3D Shell Structures With Curved Surfaces Using Controlled Self-Folding

Dongping Deng, Yong Chen

Proc. ASME. MSEC2015, Volume 1: Processing, V001T02A070, June 8–12, 2015

Paper No: MSEC2015-9459

DOI: https://doi.org/10.1115/MSEC2015-9459

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Topics: Design, Manufacturing, Printing, Shells, Shapes, Hinges, Active materials, Algorithms, Biomedicine, Deformation

Proceedings Papers

Analytical Design and Implementation of a Uniform Pressure Actuator for Electromagnetic Forming and Welding

E. Thibaudeau, B. L. Kinsey

Proc. ASME. MSEC2013, Volume 1: Processing, V001T01A015, June 10–14, 2013

Paper No: MSEC2013-1238

DOI: https://doi.org/10.1115/MSEC2013-1238

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Topics: Actuators, Analytical design, Pressure, Welding, Design, Modeling, Finite element analysis, Sheet metal, Aerospace industry, Electronics

NARROW

Encapsulating and Inkjet-Printing Electronics on Flexible Substrates for Harsh Environment

Ultrafast Laser Direct Writing of Conductive Patterns on Polyimide Substrate

Enhancing Conductivity in 3D Bulk-Embedded Electronics

Packaging Electronics on Textiles: Identifying Fiber Junctions for Automated Placement

A State-of-the-Art Review on Aerosol Jet Printing (AJP) Additive Manufacturing Process

Microwave-Assisted Processing of Regenerated Silk Fibroin Films

Use of Programmed Piezo Crystal Flexures for Economic Vapor Deposition of Parylene HT ® on Unlimited Lengths of Magnet Wire

Active Control of Fabricating Nanofibrous Wavy/Helical Arrays Using Near-Field Electrospinning

Transport and Interfacial Phenomena in Nanoscale Confined Laser Crystallization

Rapid Intense Pulse Light Sintering of Copper Sulphide Nanoparticle Films

Design of a Tip Based In-Line Metrology System for Roll-to-Roll Manufactured Flexible Electronic Devices

Active Mixing Nozzle for Multi-Material and Multi-Scale 3D Printing

Forecasting Obsolescence Risk Using Machine Learning

Fabricating Microchannels in Elastomer Substrates for Stretchable Electronics

Agent Based Simulation Optimization of Waste Electrical and Electronics Equipment Recovery

Design and Modeling of a Microscale Selective Laser Sintering System

The Leidenfrost Effect at the Nanoscale

Process Parameter Studies of Molecular Dynamics Models to Control Substrate Wettability

4D Printing: Design and Fabrication of 3D Shell Structures With Curved Surfaces Using Controlled Self-Folding

Analytical Design and Implementation of a Uniform Pressure Actuator for Electromagnetic Forming and Welding

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