1-8 of 8
Silicon nitride ceramics
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Dependence of Bonding Temperature Conditions on Metal Thickness Effects in Bonded Dissimilar Materials

Masayoshi Tateno, Eiichiro Yokoi
Proc. ASME. PVP2015, Volume 6B: Materials and Fabrication, V06BT06A049, July 19–23, 2015
Paper No: PVP2015-45822
DOI: https://doi.org/10.1115/PVP2015-45822
View Paper
PDF
Topics: Bonding, Metals, Temperature, Ceramics, Stress, Composite materials, High temperature, Nickel, Silicon nitride ceramics, Tensile strength
Proceedings Papers

Effects of Metal Thickness on Bonding Strength in Bonded Dissimilar Materials

Masayoshi Tateno, Takahiro Miura
Proc. ASME. PVP2014, Volume 6A: Materials and Fabrication, V06AT06A028, July 20–24, 2014
Paper No: PVP2014-29021
DOI: https://doi.org/10.1115/PVP2014-29021
View Paper
PDF
Topics: Bonding, Metals, Ceramics, Tensile strength, Stress, Stress concentration, Experimental analysis, Finite element analysis, Finite element methods, Finite element model
Proceedings Papers

Dependence of Bonding Strength of Ceramic to Metal Joint on Interface Wedge Angle in Metal Side

Masayoshi Tateno, Eiichiro Yokoi
Proc. ASME. PVP2012, Volume 6: Materials and Fabrication, Parts A and B, 247-252, July 15–19, 2012
Paper No: PVP2012-78682
DOI: https://doi.org/10.1115/PVP2012-78682
View Paper
PDF
Topics: Bonding, Ceramics, Metals, Wedges, Shapes, Electrical discharge machining, Fracture (Materials), Fracture (Process), High temperature, Silicon nitride ceramics
Proceedings Papers

Optical Strain Monitoring Techniques

Aditya Narayanan, Andy Morris, Catrin M. Davies, John P. Dear
Proc. ASME. PVP2012, Volume 7: Operations, Applications and Components, 81-88, July 15–19, 2012
Paper No: PVP2012-78515
DOI: https://doi.org/10.1115/PVP2012-78515
View Paper
PDF
Topics: Creep, Deformation, Gages, Heat, Lenses (Optics), Maintenance, Plates (structures), Power stations, Silicon nitride ceramics, Strain measurement
Proceedings Papers

Recent Developments in ARCMAC and Related Creep Strain Monitoring Techniques

Aditya Narayanan, Andy Morris, Catrin Mair Davies, John Dear
Proc. ASME. PVP2011, Volume 7: Operations, Applications, and Components, 331-336, July 17–21, 2011
Paper No: PVP2011-57948
DOI: https://doi.org/10.1115/PVP2011-57948
View Paper
PDF
Topics: Creep, High temperature, Strain measurement, Gages, Pipes, Steam, Image formation, Power stations, Resolution (Optics), Silicon nitride ceramics
Proceedings Papers

Threshold Stress for Crack-Healing of Silicon Nitride Ceramics

Koji Takahashi, Kotoji Ando, Shoko Yoshida, Shinji Saito
Proc. ASME. PVP2004, Elevated Temperature Design and Analysis, Nonlinear Analysis, and Plastic Components, 195-200, July 25–29, 2004
Paper No: PVP2004-2992
DOI: https://doi.org/10.1115/PVP2004-2992
View Paper
PDF
Topics: Fracture (Materials), Silicon nitride ceramics, Stress, Bending strength, Bending (Stress), Ceramics, Composite materials, Fatigue strength, Surface cracks, Temperature
Proceedings Papers

Improvement of Static Fatigue Strength of Silicon Nitride Composite

Koji Takahashi, Kotoji Ando, Shinji Saito
Proc. ASME. PVP2005, Volume 3: Design and Analysis, 269-272, July 17–21, 2005
Paper No: PVP2005-71339
DOI: https://doi.org/10.1115/PVP2005-71339
View Paper
PDF
Topics: Composite materials, Fatigue strength, Silicon nitride ceramics, Fracture (Materials), Fatigue, Bending (Stress), Bending strength, Ceramics, Oxidation, Stress
Proceedings Papers

Finite-Element Modeling of the Thermal/Structural Response of a Rifled Silicon-Nitride Barrel Subjected to Thermal and Pressure Transients

A. E. Segall, R. Carter
Proc. ASME. PVP2006-ICPVT-11, Volume 3: Design and Analysis, 847-856, July 23–27, 2006
Paper No: PVP2006-ICPVT-11-93409
DOI: https://doi.org/10.1115/PVP2006-ICPVT-11-93409
View Paper
PDF
Topics: Finite element analysis, Modeling, Pressure, Silicon nitride ceramics, Transients (Dynamics)