Based on an energy minimization principle, a mathematical/numerical model has been developed to study the impact of design and process variations associated with flip-chip solder joint on its ability to align in lateral and axial direction. The minimum-energy shape needed for joint evaluation is computed by a novel numerical method based on motion by mean curvature. The analysis shows that (1) the magnitude of the reaction force in lateral and axial direction reduces with increase in solder volume, (2) the normal reaction is an order of magnitude higher compared to the lateral reaction (restoring force) thus making the joint more susceptible to lateral misalignment compared to the axial misalignment, and (3) the axial misalignment is primarily dictated by the accuracy of the solder deposition height.

Issue Section:
Technical Papers
Topics:
Flip-chip, Solder joints, Solders, Computer simulation, Design, Energy conservation, Numerical analysis, Shapes
1.
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C. A.
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,
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IEPS
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1
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4
4
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2.
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,”
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6.
Goldmann, L. S., 1972, “Self-Alignment Capability of Controlled-Col-lapse Chip Joining,” Proc. 22nd Electronic Component Conference, pp. 332–339.
7.
Katyl
 
H.
, and
Pimbley
 
W. T.
,
1992
, “
Shape and Force Relationships for Molten Axisymmetric Solder Connections
,”
ASME Journal of Electronic Packaging
, Vol.
114
, pp.
336
–
341
.
8.
Johnson
 
R. E.
, and
Dettre
 
R. H.
,
1964
, “
Contact Angle Hysteresis III: Study of an Idealized Heterogeneous Surface
,”
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Neumann
 
A. W.
, and
Good
 
R. J.
,
1972
, “
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,”
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341
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10.
Oliver
 
J. F.
,
Huh
 
C.
, and
Mason
 
S. G.
,
1977
, “
Resistance of Spreading Liquid by Sharp Edge
,”
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59
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581
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11.
Patra, S. K., and Lee, Y. C., 1991, “Quasi-Static Modeling of Self-Alignment Mechanism in Flip-Chip Soldering Process, Part I: Single Joint,” ASME Journal of Electronic Packaging.
12.
Trudinger
 
N. S.
, and
Kuo
 
H. J.
,
1992
, “
Discrete Methods for Fully Nonlinear Elliptic Equations
,”
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, Vol.
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13.
Tsunetsugu, H., Katasura, K., Hayashi, T., Ishitsuka, F., Hata, S., and Takachio, N., 1991, “A New Packaging Technology for High-Speed Photoreceivers Using Micro-Solder Bumps,” 41 ECTC p. 479–482.
14.
Wilkinson
 
M. C.
,
Zettlemoyer
 
A. C.
,
Aronson
 
M, P.
, and
Vanderhoff
 
J. W.
, 1979, “
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,”
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3
, p.
508
–
544
.
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 by The American Society of Mechanical Engineers
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