The interface crack problem of bonded piezoelectric and elastic half-space under transient electromechanical loads is considered. Both the permeable and impermeable boundary conditions are examined and discussed. Based on the use of integral transform techniques, the problem is reduced either to a singular integral equation for the permeable boundary condition or to two coupled singular integral equations for the impermeable boundary condition, which can be solved using Chebyshev polynomial expansions. Numerical results are provided to show the effect of the applied electric fields, the electric boundary conditions along the crack faces and a free surface on the resulting dynamic stress intensity factor and electric displacement intensity factor.
The Interface Crack Problem of Bonded Piezoelectric and Elastic Half-Space Under Transient Electromechanical Loads
Contributed by the Applied Mechanics Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS for publication in the ASME JOURNAL OF APPLIED MECHANICS. Manuscript received by the ASME Applied Mechanics Division, Mar. 1, 2001; final revision, Nov. 26, 2001. Associate Editor: K. Ravi-Chandar. Discussion on the paper should be addressed to the Editor, Prof. Lewis T. Wheeler, Department of Mechanical Engineering, University of Houston, Houston, TX 77204-4792, and will be accepted until four months after final publication of the paper itself in the ASME JOURNAL OF APPLIED MECHANICS.
- Views Icon Views
- Share Icon Share
- Search Site
Meguid , S. A., and Zhao, X. (May 3, 2002). "The Interface Crack Problem of Bonded Piezoelectric and Elastic Half-Space Under Transient Electromechanical Loads ." ASME. J. Appl. Mech. May 2002; 69(3): 244–253. https://doi.org/10.1115/1.1460910
Download citation file: