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Just Accepted Manuscript
Research-Article May 2, 2022
Electro-Thermal Analysis of System in Package for Aerospace Application
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4054462
Research-Article May 2, 2022
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4054461
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