This paper describes an optical method that has been developed to accurately measure shrinkage during the cure of adhesives treated with UV light. The experiment was designed to measure changes in the volume of very small quantities of material appropriate to uses in the fiber-optic and micro-electronic industries. A spot-curing device (EFOS Inc.) was used to deliver a controlled exposure of UV-light with a known distribution of wavelengths to the sample. The results indicate that reproducible values for the volumetric shrinkage can be achieved using spot-curing methods. The technique described in this paper, combined with other experimental measurements under development, will assist in the selection of the appropriate adhesive for specific applications and the curing conditions needed to optimize its final properties.
Skip Nav Destination
Article navigation
December 2002
Technical Papers
Optical Measurements of Shrinkage in UV-Cured Adhesives
A. J. Hudson,
A. J. Hudson
EFOS Inc., Mississauga, Ontario, Canada L5N 6H7
Search for other works by this author on:
S. C. Martin,
S. C. Martin
EFOS Inc., Mississauga, Ontario, Canada L5N 6H7
Search for other works by this author on:
M. Hubert,
M. Hubert
EFOS Inc., Mississauga, Ontario, Canada L5N 6H7
Search for other works by this author on:
J. K. Spelt
J. K. Spelt
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, Ontario, Canada M5S 3G8
Search for other works by this author on:
A. J. Hudson
EFOS Inc., Mississauga, Ontario, Canada L5N 6H7
S. C. Martin
EFOS Inc., Mississauga, Ontario, Canada L5N 6H7
M. Hubert
EFOS Inc., Mississauga, Ontario, Canada L5N 6H7
J. K. Spelt
Department of Mechanical and Industrial Engineering, University of Toronto, Toronto, Ontario, Canada M5S 3G8
Contributed by the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel.
J. Electron. Packag. Dec 2002, 124(4): 352-354 (3 pages)
Published Online: December 12, 2002
Article history
Received:
May 1, 2002
Online:
December 12, 2002
Citation
Hudson , A. J., Martin , S. C., Hubert, M., and Spelt, J. K. (December 12, 2002). "Optical Measurements of Shrinkage in UV-Cured Adhesives ." ASME. J. Electron. Packag. December 2002; 124(4): 352–354. https://doi.org/10.1115/1.1498264
Download citation file:
Get Email Alerts
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Related Articles
Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
J. Electron. Packag (March,2005)
Snap-Curing Electrically Conductive Formulation for Solder
Replacement Applications
J. Electron. Packag (June,2005)
Polymerization Shrinkage Stress in Resin-Based Dental Materials
J. Med. Devices (September,2015)
Investigation of Workpiece Distortion During the Photopolymerization of a PAAW Joint
J. Manuf. Sci. Eng (November,2016)
Related Proceedings Papers
Characterization of Non-Conductive Adhesives
InterPACK2005
Related Chapters
Simulation and Optimization of Injection Process for LCD Cover
Proceedings of the 2010 International Conference on Mechanical, Industrial, and Manufacturing Technologies (MIMT 2010)
Conjugate Priors with Zero Occurrences: Analyst Beware! (PSAM-0435)
Proceedings of the Eighth International Conference on Probabilistic Safety Assessment & Management (PSAM)
Developing a Risk Assessment and Mitigation Strategy
Risk Management for Project Managers: Concepts and Practices