Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the intermetallics. As a result, it was shown that the long cast time yielded the intermetallics and microstructures of the solder invariable regardless of aging condition. The granular micro-structure of the air-cooled specimens was shown to be inferior to the laminated micro-structure of the furnace-cooled specimens. Also, transition of fatigue crack behavior with and the procedure of fatigue crack propagation from the pre-crack tip were discussed.
Issue Section:
Additional Technical Papers
1.
Lau, J. H., 1991, Solder Joint Reliability, Van Nostrand Reinhold, New York, NY.
2.
Frear, D. R., Burchett, S. N., and Morgan, H. S., 1994, The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold, New York, NY.
3.
McKeown, S. A., 1993, “Solder Life Prediction of Leadless and Leaded Surface Mount Components Under Thermal Cycling and Vibration,” Adv. Electronic Packaging, EEP-Vol. 4-2, pp. 987–994.
4.
Sidharth
, and Baker
, D. B.
, 1996
, “Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
,” ASME J. Electron. Packag.
, 118
, pp. 244
–249
.5.
Logsdon
, W. A.
, Liaw
, P. K.
, and Burke
, M. A.
, 1990
, “Fracture Behavior of 63Sn-37Pb Solder
,” Eng. Fract. Mech.
, 36
, pp. 183
–218
.6.
Cutiongco
, E. C.
, Vaynman
, S.
, Fine
, M. E.
, and Jeannotte
, D. A.
, 1990
, “Isothermal Fatigue of 63Sn-37Pb Solder
,” ASME J. Electron. Packag.
, 112
, pp. 110
–114
.7.
Guo
, Z.
, and Conrad
, H.
, 1993
, “Fatigue Crack Growth Rate in 63Sn37Pb Solder Joints
,” ASME J. Electron. Packag.
, 115
, pp. 159
–164
.8.
Choi
, S. H.
, Song
, B. G.
, Kang
, K. J.
, and Fleck
, N. A.
, 2001
, “Fracture of a Ductile Layer Constrained by Stiff Substrates
,” Fatigue Fract. Eng. Mater. Struct.
, 23
, pp. 1
–13
.9.
Song
, J. H.
, Shin
, Y. S.
, and Im
, Y. S.
, 1989
, “Construction of Small Sized, Electro-Dynamic Type Bending Fatigue Testing Machine,” in Korean
KSME Trans. A
, 13
(1
), pp. 199
–203
.10.
Hutchinson
, J. W.
, and Suo
, Z.
, 1991
, “Mixed Mode Cracking in Layered Materials
,” Adv. Appl. Mech.
, 28
, pp. 1
–21
.11.
ABAQUS, 1996, User’s Manual, Version 5.6, HKS Inc.
12.
Lampe
, B. T.
, 1976, “Room Temperature Aging Properties of Some Solder Alloys,” Welding Research Supplement, p. 330-s–340-s.13.
Morris, J. W., Jr., Goldstein, J. L. F., and Mei, Z., 1994, “Microstructual Influences on the mechanical properties of solder,” The Mechanics of Solder Alloy Interconnects, eds., D. R. Frear, S. N. Burchett, and H. S. Morgan, Van Nostrand Reinhold, pp. 7–41.
14.
Yao
, D.
, and Shang
, J. K.
, 1995
, “Effect of Aging on Fatigue Crack Growth at Sn-Pb/Cu Interfaces
,” Metall. Mater. Trans. A
, 26A
, pp. 2677
–2685
.15.
Miller
, K. J.
, 1991
, “Metal Fatigue—Past, Current and Future
,” I Mech E Conf. Publ.
, 205
, pp. 1
–14
.Copyright © 2002
by ASME
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