An analytical model relating the degree of cure of an underfill epoxy to the heat transfer coefficient of the heating process and time is presented. The model was verified experimentally by partially curing samples of a commercial underfill epoxy in two different heating environments for various times and scanning the samples in a differential scanning calorimeter to determine the degree of cure. A simplified equation can be used to relate the time required to achieve a given degree of cure to the heat transfer coefficient and the isothermal cure time.

1.
Suryanarayana
,
D.
,
Hsiao
,
R.
,
Gall
,
T. P.
, and
McCreary
,
J. M.
,
1991
, “
Enhancement of Flip-Chip Fatigue Life by Encapsulation
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
14
(
1
), pp.
218
223
.
2.
Shi, D. M., and Carbin, J. W., 1996,“Advances in Flip-Chip Underfill Flow and Cure Rates and their Enhancement of Manufacturing Processes and Component Reliability,” IEEE Electronic Components and Technology Conference.
3.
Wun, K. B. and Margaritis, G., 1996, “The Evaluation of Fast-Flow, Fast-Cure Underfills for Flip Chip on Organic Substrates,” IEEE Electronic Components and Technology Conference.
4.
Bonneau, M. and Stewart, J., 1997, “Reduced Cycle Time Epoxies for Flip Chip Underfill,” Int. Symposium on Advanced Packaging Materials.
5.
Ghoshal
,
R.
,
Sambasivam
,
M.
, and
Mukerji
,
P. K.
, 1997, “Novel Epoxy-Based Compositions for Microelectronic Packaging Applications,” Microelectron. Int., 14(3), pp. 12–14, 18.
6.
Merton
,
M. M.
,
Malhotra
,
C. P.
,
Nikmanesh
,
N.
, and
Mahajan
,
R. L.
, Dec
1999
, “
Alternative Curing Methods for FCOB Underfill
,”
ASME J. Electron. Packag.
,
121
(
4
), pp.
249
254
.
7.
Aung, W., 1973, “Calculation of Resin Temperature and Resin Flow Rate during Multilayer Board Lamination,” Int. Electronic Packaging and Production Conf., INTERNEPCON EUROPE, Brussels.
8.
Prime
,
R. B.
,
1973
, “
Differential Scanning Calorimetry of the Epoxy Cure Reaction
,”
Polym. Eng. Sci.
,
13
, pp.
365
371
.
9.
Springer, G. S., 1982, “A Model of the Curing Process of Epoxy Matrix Composites,” Progress in Science and Engineering of Composites, Japan Society for Composite Materials, pp. 23–35.
10.
Lee
,
W. L.
,
Loos
,
A. C.
, and
Springer
,
G. S.
,
1982
, “
Heat of Reaction, Degree of Cure and Viscosity of Hercules 3501-6 Resin
,”
J. Compos. Mater.
,
16
, pp.
510
520
.
11.
Hou
,
T. H.
, and
Bai
,
J. M.
,
1988
, “
A Semi-empirical approach for the chemiviscosity modeling of Reactive Resin System
,”
SAMPE Q.
,
24
(
6
), pp.
43
51
.
12.
Turi, E. A., 1997, Thermal Characterization of Polymeric Materials, 2nd Edition, Academic Press, San Diego, CA.
13.
Incropera, F. P. and De Witt, D. P., 1990, Fundamentals of Heat and Mass Transfer, 3rd Edition, John Wiley & Sons, New York, NY.
14.
Mahajan
,
R. L.
,
Chu
,
T. Y.
, and
Dickinson
,
D. A.
,
1991
, “
An Experimental Study of Laminar Film Condensation with Stefan number greater than unity
,”
ASME J. Heat Transfer
,
113
, pp.
472
477
.
15.
Beyer, W. H., 1991, CRC Standard Mathematical Tables and Formulas, 29th Edition, CRC Press, Boca Raton, FL, p. 259.
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