Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination of the thermal-fatigue life of the solder sealing ring under shipping/storing/handling conditions. The solder ring is assumed to obey the Garofalo-Arrhenius creep constitutive law. The nonlinear responses such as the deflections, stresses, creep strains, and creep strain energy density of the 3-D photonic package have been determined with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life of the solder sealing ring is readily determined and is found to be more than adequate for shipping/storing/handling the photonic switches.
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December 2002
Additional Technical Papers
Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
J. Lau, Fellow ASME,
J. Lau, Fellow ASME
Agilent Technologies, Inc., Santa Clara, CA 95052
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Z. Mei,
Z. Mei
Agilent Technologies, Inc., Santa Clara, CA 95052
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S. Pang,
S. Pang
Agilent Technologies, Inc., Santa Clara, CA 95052
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C. Amsden,
C. Amsden
Agilent Technologies, Inc., Santa Clara, CA 95052
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J. Rayner,
J. Rayner
Agilent Technologies, Inc., Santa Clara, CA 95052
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S. Pan
S. Pan
Agilent Technologies, Inc., Santa Clara, CA 95052
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J. Lau, Fellow ASME
Agilent Technologies, Inc., Santa Clara, CA 95052
Z. Mei
Agilent Technologies, Inc., Santa Clara, CA 95052
S. Pang
Agilent Technologies, Inc., Santa Clara, CA 95052
C. Amsden
Agilent Technologies, Inc., Santa Clara, CA 95052
J. Rayner
Agilent Technologies, Inc., Santa Clara, CA 95052
S. Pan
Agilent Technologies, Inc., Santa Clara, CA 95052
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division, 2001; revised manuscript received August 6, 2002. Associate Editor: E. Suhir.
J. Electron. Packag. Dec 2002, 124(4): 403-410 (8 pages)
Published Online: December 12, 2002
Article history
Revised:
August 6, 2002
Online:
December 12, 2002
Citation
Lau, J., Mei , Z., Pang , S., Amsden , C., Rayner , J., and Pan , S. (December 12, 2002). "Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch ." ASME. J. Electron. Packag. December 2002; 124(4): 403–410. https://doi.org/10.1115/1.1512294
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