The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems to accommodate steady-state conditions as opposed to fixed duty cycles can substantially increase cost, size, and weight. The feasibility of transient thermal management of handsets using phase change materials (PCMs) was experimentally investigated using an ABS handset mock-up. At selected intervals of time, the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were numerically computed from the temperature data in the thermal images. The effects of PCM material, power supplied to the handset, and handset orientation on the time required for the handset case to reach a given (maximum) temperature and “recovery” time were examined.
Issue Section:
Additional Technical Papers
1.
Cao
, L.
, Krusius
, J.P.
, Korhonen
, M.
, and Fisher
, T.
, 1998
, “Transient Thermal Management of Portable Electronics Using Heat Storage and Dynamic Power Dissipation Control
,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A
, 21
(1
), pp. 113
–123
.2.
Ramakrishna, K., Lee, T.Y., Hause, J.V., Chambers, B.C., and Mahalingam, M., 1996, “Experimental Evaluation of Thermal Performance of and Cooling Enhancements to a Hand-held Portable Electronic System,” Process, Enhanced, and Multiphase Heat Transfer: A Festschrift for A.E. Bergles, Begell House, Inc., pp. 217–226.
3.
Minichiello, A., Hartley, J., Glezer, A., and Black, W, 1997, “Thermal Management of Sealed Electronic Enclosures Using Synthetic Jet Technology,” Interpack ’97, ASME EEP-Vol. 19-2, Advances in Electronic Packaging, Vol. 2, pp. 1809–1812.
4.
Leoni, N., and Amon, C.H., 1997, “Transient Thermal Design of Wearable Computers with Embedded Electronics Using Phase Change Materials,” ASME HTD-Vol. 343, National Heat Transfer Conference, Vol. 5, pp. 49–56.
5.
Vesligaj
, M.
, and Amon
, C.H.
, 1999
, “Transient Thermal Management of Temperature Fluctuations during Time Varying Workloads on Portable Electronics
,” IEEE Trans. Compon., Hybrids, Manuf. Technol.
, 22
(4
), pp. 1415
–1424
.6.
Alawadhi, E.M., and Amon, C.H., 2000, “PCM Thermal Storage Unit for Time-Dependent Thermal Management of Electronic Devices,” Proc., NHTC2000, ASME Paper No. 12195, Pittsburgh, PA.
7.
Hodes, M., Manzione, L., and Chen, C., 1999 “Thermal Management of Hand-held Portable Electronics,” Plastic for Portables and Wireless Electronics Conference, Society of Plastic Engineers. January 25–26, Sheraton Mesa Hotel, Mesa, AZ.
8.
Frisby Technologies, 1998, “Physical Properties of Thermasorb® Additives,” (product literature describing Frisby Technologies’ micro-encapsulated PCMs).
9.
Fosset
, A.
, Maguire
, T.
, Kudirka
, A.
, Mills
, F.
, and Brown
, D.
, 1998
, “Avionics Passive Cooling with Microencapsulated Phase Change Materials
,” ASME J. Electron. Packag.
, 120
, pp. 238
-242
.10.
Wirtz, R.A., Zheng, N., Chandra, D., 1999, “Thermal Management Using “Dry” Phase Change Materials,” Proc., IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 74–82.
11.
Zheng, N., and Wirtz, R.A., 2001, “Figures of Merit for Hybrid Thermal Energy Storage Units,” Proc., NHTC2001, ASME Paper No. 20027, Anaheim, CA.
12.
Lienhard IV, J.H., “On the Commonality of Equations for Natural Convection from Immersed Bodies,” Int. J. Heat Mass Transf., 16, pp. 2121–2123.
13.
Henry Dreyfuss Associates, 1993, “The Measure of Man and Women, Human Factors in Design,” Whitney Library of Design, Watson-Guptill Publications, pp. 82–83.
14.
Weinstein, R.D., Hodes, M., and Piccini, J., 2001, “Improved Static and Transient Thermal Management of Handsets Using Heat Spreaders and Phase Change Materials (PCMs),” Proc., NHTC2001, ASME Paper No. 1441, Anaheim, CA.
15.
Burns, G.W., Scroger, M.G., Strouse, G.F., Croarkin, M.C., and Guthrie, W.F., 1993, “Temperature-Electromotive Force Reference Functions and Tables for Letter-Designated Thermocouple Types Based on the ITS- 90,” NIST Monograph 175, p. 250.
16.
Incropera, F.P., and DeWitt, D.P., 1996, Fundamentals of Heat and Mass Transfer, 4th Edition, John Wiley and Sons, Inc., New York, NY.
17.
Sergent, J.E., and Krum, A., 1998, Thermal Management Handbook for Electronic Assemblies, McGraw-Hill, New York, NY.
18.
Ostrach, S., 1952, “An Analysis of Laminar Free-Convection Flow and Heat Transfer about a Flat Plate Parallel to the Direction of the Generating Body Force,” Technical Note 2635, National Advisory Committee for Aeronautics, Washington DC.
19.
Pence, S., 2000, “Thermal Management of Portable Electronic Devices Using Phase Change Materials,” Bachelor’s of Chemical Engineering thesis, Villanova University.
20.
Hodes, M., Weinstein, R.D., Pence, S.J., Talieri, J.A., Manzione, L., and Chen, C., 2000, “Transient Thermal Management of Handsets Using Phase Change Materials (PCMs),” Proc., NHTC2000, ASME Paper No. 12196, Pittsburgh, PA.
21.
Reilly
, J.J.
, and Wiswall
, R.H.
Jr., 1968
, “The Reactions of Hydrogen with Alloys of Magnesium and Nickel and the Formation of Mg2NiH4,
” Inorg. Chem.
, 7
(11
), pp. 2254
–2256
.22.
Chen
, P.
, Wu
, X.
, Lin
, J.
, and Tan
, K.L.
, 1999
, “High H2 Uptake by Alkali-Doped Carbon Nanotubes under Ambient Pressure and Moderate Temperatures
,” Science
, 285
, pp. 91
–93
.23.
Himran
, S.
, Suwono
, A.
, and Mansoori
, G.
, 1994
, “Characterization of Alkanes and Paraffin Waxes for Application as Phase Change Energy Storage Medium
,” Energy Sources
, 16
, pp. 117
–128
.Copyright © 2002
by ASME
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