In this study, a computational fluid dynamics model has been developed to explain and validate the experimental results originating from the concept of a substrate with an opening. It is found that the openings will interrupt the growth of the boundary layer on substrate surfaces and hence improve the cooling ability of a module without any additional active parts. Furthermore, the concept of openings has not only so far provided at least 12% improvement in heat transfer, but also reduced some difficulties in finding thermal solution, such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect.
Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection
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Tseng, Y., Hung, T., and Pei, B. (January 31, 2008). "Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection." ASME. J. Electron. Packag. March 2008; 130(1): 011006. https://doi.org/10.1115/1.2837524
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