In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using the DEvelopment of Libraries of PHysical models for an Integrated design (DELPHI) methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction and typically has four fixed heat generating sources. The detailed model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all “thinkable” boundary conditions that are experienced by the SFP device in practical situations. The commercial optimization tool developed by the DELPHI team, DOTCOMP, is used for generating the compact thermal model. A detailed validation of the CTM of the SFP in real-time applications using FLOTHERM 7.2, a computational fluid dynamics-based thermal analysis software package, is performed. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model. The SFP CTM predicts the junction temperature of the four power-dissipating components and the heat flows through the sides with relative error less than 10%.
Skip Nav Destination
e-mail: Urmila.ghia@uc.edu
e-mail: kghia@cfdrl.uc.edu
Article navigation
March 2011
Research Papers
Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
Urmila Ghia,
Urmila Ghia
Department of Mechanical Engineering, Computational Fluid Dynamics Research Laboratory,
e-mail: Urmila.ghia@uc.edu
University of Cincinnati
Search for other works by this author on:
Karman Ghia,
Karman Ghia
Department of Aerospace Engineering, Computational Fluid Dynamics Research Laboratory,
e-mail: kghia@cfdrl.uc.edu
University of Cincinnati
Search for other works by this author on:
William Maltz
William Maltz
Search for other works by this author on:
Arun Prakash Raghupathy
John Janssen
Attila Aranyosi
Urmila Ghia
Department of Mechanical Engineering, Computational Fluid Dynamics Research Laboratory,
University of Cincinnati
e-mail: Urmila.ghia@uc.edu
Karman Ghia
Department of Aerospace Engineering, Computational Fluid Dynamics Research Laboratory,
University of Cincinnati
e-mail: kghia@cfdrl.uc.edu
William Maltz
J. Electron. Packag. Mar 2011, 133(1): 011003 (10 pages)
Published Online: March 3, 2011
Article history
Received:
February 22, 2010
Revised:
November 12, 2010
Online:
March 3, 2011
Published:
March 3, 2011
Citation
Raghupathy, A. P., Janssen, J., Aranyosi, A., Ghia, U., Ghia, K., and Maltz, W. (March 3, 2011). "Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages." ASME. J. Electron. Packag. March 2011; 133(1): 011003. https://doi.org/10.1115/1.4003217
Download citation file:
Get Email Alerts
Cited By
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
Related Articles
A Comparative Study of the Performance of Compact Model Topologies and Their Implementation in CFD for a Plastic Ball Grid Array Package
J. Electron. Packag (September,2001)
Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp
J. Electron. Packag (March,2021)
A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating
J. Heat Transfer (January,2005)
Compact Thermal Models: A Global Approach
J. Electron. Packag (December,2008)
Related Proceedings Papers
Related Chapters
System Thermal Analysis—Small Box
Thermal Management of Telecommunications Equipment
System Thermal Analysis – Small Boxes
Thermal Management of Telecommunication Equipment, Second Edition
Introduction
Thermal Management of Microelectronic Equipment