In this work, a novel ball grid array (BGA) interconnection process has been developed using solderable polymer–solder composites (SPCs) with low-melting-point alloy (LMPA) fillers to enhance the processability of the conventional capillary underfill technique and to overcome the limitations of the no-flow underfill technique. To confirm the feasibility of the proposed technique, a BGA interconnection test was performed using four types of SPCs with a different LMPA concentration (from 0 to 5 vol %). After the BGA interconnection process, the interconnection characteristics, such as morphology of conduction path and electrical properties of the BGA assemblies, were inspected and compared. The results indicated that BGA assemblies using SPC without LMPA fillers showed weak conduction path formation, including open circuit (solder bump loss) or short circuit formation because of the expansion of air voids within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SPC with 3 vol % LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the relatively low-reflow peak temperature and favorable selective wetting behavior of molten LMPAs for the solder bumps and Cu metallizations.
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December 2017
Research-Article
Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
Byung-Seung Yim,
Byung-Seung Yim
Department of Mechanical Engineering,
Kangwon National University,
Gangwon-do 25913, South Korea
Kangwon National University,
Gangwon-do 25913, South Korea
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Young-Eui Shin,
Young-Eui Shin
School of Mechanical Engineering,
Chung-Ang University,
Seoul 156-756, South Korea
e-mail: shinyoun@cau.ac.kr
Chung-Ang University,
Seoul 156-756, South Korea
e-mail: shinyoun@cau.ac.kr
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Jong-Min Kim
Jong-Min Kim
School of Mechanical Engineering,
Chung-Ang University,
Seoul 156-756, South Korea
e-mail: 0326kjm@cau.ac.kr
Chung-Ang University,
Seoul 156-756, South Korea
e-mail: 0326kjm@cau.ac.kr
Search for other works by this author on:
Byung-Seung Yim
Department of Mechanical Engineering,
Kangwon National University,
Gangwon-do 25913, South Korea
Kangwon National University,
Gangwon-do 25913, South Korea
Young-Eui Shin
School of Mechanical Engineering,
Chung-Ang University,
Seoul 156-756, South Korea
e-mail: shinyoun@cau.ac.kr
Chung-Ang University,
Seoul 156-756, South Korea
e-mail: shinyoun@cau.ac.kr
Jong-Min Kim
School of Mechanical Engineering,
Chung-Ang University,
Seoul 156-756, South Korea
e-mail: 0326kjm@cau.ac.kr
Chung-Ang University,
Seoul 156-756, South Korea
e-mail: 0326kjm@cau.ac.kr
1Corresponding authors.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received January 25, 2017; final manuscript received September 24, 2017; published online October 13, 2017. Assoc. Editor: Kaushik Mysore.
J. Electron. Packag. Dec 2017, 139(4): 041007 (9 pages)
Published Online: October 13, 2017
Article history
Received:
January 25, 2017
Revised:
September 24, 2017
Citation
Yim, B., Shin, Y., and Kim, J. (October 13, 2017). "Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers." ASME. J. Electron. Packag. December 2017; 139(4): 041007. https://doi.org/10.1115/1.4038028
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