First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability, January 13–14, 2003 City University of Hong Kong Hong Kong, China; January 15–17, 2003 Shenzhen, China
You are cordially invited to submit papers to an International IEEE Conference on the Business of Electronic Product Reliability and Liability. The conference will be held in Hong Kong and Shenzhen, China (transportation to Shenzhen will be provided). The purpose of the Conference is to present the latest advancements in electronic product reliability and liability, and to discuss critical international issues as they affect the global technical and business community. The goal is to help electronics companies design and manufacture cost-effective reliable products, and encourage efficient supply-chain management.
Abstracts and Papers
We currently have 15 industry experts who will be presenting papers on reliability and liability. Papers are now invited from other industry participants as well as researchers from academic and government organizations on the following topics:
— Design for reliability
— Advances in derating
— Screening and burn-in
— Accelerated testing
— Advances in reliability prediction including the new IEEE Standards
— Risks associated with using telecommunications Reliability Standards
— Uprating
— New failure mechanisms in electronic products
— Root-cause analysis
An electronic form of a one-page, 300-word abstract with name, address, phone and fax numbers, and e-mail address must be submitted to the technical committee by e-mail at wywong@ee.cityu.edu.hk on/before August 15, 2002. Instructions for preparing the full paper will be sent to authors whose abstracts are accepted after review. Accepted papers will be published in a formal IEEE Conference Proceedings with an ISBN number. Participants will be required to register for the conference upon notification of acceptance of their full papers.
Important Dates
August 15, 2002 Abstract Submission
September 15, 2002 Abstract Acceptance
November 15, 2002 Full Paper Due
Correspondence and Inquiries
Ms. Angie Wong
Secretariat of International IEEE Conference
EPA Center
Department of Electronic Engineering
City University of Hong Kong
83 Tat Chee Avenue, Hong Kong
Tel: (852) 2788 7379
Fax: (852) 2788 7579
e-mail: wywong@ee.cityu.edu.
