Volume 124 Issue 4 | J. Electron. Packag.

Editorial

Special Issue on Poly’2000, London

Bernd Michel,, Guest Editor, Poly’2000 Co-chair, Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair

J. Electron. Packag. December 2002, 124(4): 317. doi: https://doi.org/10.1115/1.1497626

View articletitled, Special Issue on Poly’2000, London

Topics: Adhesion , Adhesives , Fracture mechanics , Integrated circuit packaging , Packaging , Polymers , Reliability , Stress , Thermal management , Workshops (Work spaces)

Technical Papers

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

J. Auersperg, E. Kieselstein, A. Schubert, B. Michel

J. Electron. Packag. December 2002, 124(4): 318–322. doi: https://doi.org/10.1115/1.1501303

Abstract

View articletitled, Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

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Topics: Delamination , Finite element analysis , Fracture (Materials) , Fracture mechanics , Stress , Fracture toughness , Reliability , Fracture (Process) , Integrated circuits , Risk assessment

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya

J. Electron. Packag. December 2002, 124(4): 323–327. doi: https://doi.org/10.1115/1.1501304

Abstract

View articletitled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

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Topics: Fracture (Materials) , Fracture (Process) , Fracture toughness , Resins , Semiconductors (Materials) , Stress , Temperature , Stress concentration , Finite element analysis , Delamination

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

John E. Ritter, G. S. Jacome, J. R. Pelch, T. P. Russell, T. J. Lardner

J. Electron. Packag. December 2002, 124(4): 328–333. doi: https://doi.org/10.1115/1.1503064

Abstract

View articletitled, Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

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Topics: Epoxy adhesives , Epoxy resins , Fatigue , Fracture (Materials) , Glass , Stress corrosion cracking , Water , Fatigue cracks , Durability

Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)

C. L. Chung, James Fan, M. L. Huang, F. J. Tsai

J. Electron. Packag. December 2002, 124(4): 334–339. doi: https://doi.org/10.1115/1.1498265

Abstract

View articletitled, Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)

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Topics: Dams , Failure mechanisms , Reliability , Pressure , Shear strength , Shear (Mechanics) , Delamination , Optical microscopes

Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

Keith B. Bowman, David H. Mollenhauer

J. Electron. Packag. December 2002, 124(4): 340–344. doi: https://doi.org/10.1115/1.1497627

Abstract

View articletitled, Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

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Topics: Interferometry , Polymers , Residual stresses , Stress , Laminates , Temperature , Displacement , Stress concentration

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

D. Vogel, R. Ku¨hnert, M. Dost, B. Michel

J. Electron. Packag. December 2002, 124(4): 345–351. doi: https://doi.org/10.1115/1.1506698

Abstract

View articletitled, Determination of Packaging Material Properties Utilizing Image Correlation Techniques

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Topics: Atomic force microscopy , Deformation , Displacement , Displacement measurement , Flip-chip devices , Fracture (Materials) , Materials properties , Packaging , Reliability , Stress

Optical Measurements of Shrinkage in UV-Cured Adhesives

A. J. Hudson, S. C. Martin, M. Hubert, J. K. Spelt

J. Electron. Packag. December 2002, 124(4): 352–354. doi: https://doi.org/10.1115/1.1498264

Abstract

View articletitled, Optical Measurements of Shrinkage in UV-Cured Adhesives

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Topics: Adhesives , Hardening (Curing) , Shrinkage (Materials) , Ultraviolet radiation , Ultraviolet cured adhesives , Optical measurement

Application of Ice Particles for Precision Cleaning of Sensitive Surfaces

D. V. Shishkin, E. S. Geskin, B. Goldenberg

J. Electron. Packag. December 2002, 124(4): 355–361. doi: https://doi.org/10.1115/1.1511735

Abstract

View articletitled, Application of Ice Particles for Precision Cleaning of Sensitive Surfaces

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Topics: Ice , Particulate matter

Chemical-Mechanical Planarization of Low- $k$ Polymers for Advanced IC Structures

Christopher L. Borst, Dipto G. Thakurta, William N. Gill, Ronald J. Gutmann

J. Electron. Packag. December 2002, 124(4): 362–366. doi: https://doi.org/10.1115/1.1510138

Abstract

View articletitled, Chemical-Mechanical Planarization of Low-<span class="inline-formula no-formula-id"><span class="mathFormula"></span><math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><mi>k</mi></mrow></math></span> Polymers for Advanced IC Structures

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Topics: Copper , Polymers , Semiconductor wafers , Slurries , Polishing , Atomic force microscopy , Polymer films , Phthalate plasticizers

Electrically Conductive Adhesive Formulations for SMT Applications

Ryszard Kisiel

J. Electron. Packag. December 2002, 124(4): 367–370. doi: https://doi.org/10.1115/1.1497628

Abstract

View articletitled, Electrically Conductive Adhesive Formulations for SMT Applications

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Topics: Adhesive joints , Adhesives , Mechanical properties , Resins , Fillers (Materials) , Experimental design , Adhesion , Finishing

Study of P-V-T-C Relation of EMC

Yi-San Chang, Sheng-Jye Hwang, Huei-Huang Lee, Durn-Yuan Huang

J. Electron. Packag. December 2002, 124(4): 371–373. doi: https://doi.org/10.1115/1.1498266

Abstract

View articletitled, Study of P-V-T-C Relation of EMC

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Topics: Differential scanning calorimetry , Molding , Pressure , Shrinkage (Materials) , Temperature , Thermal expansion , Epoxy resins , Chemical kinetics , Viscosity

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung

J. Electron. Packag. December 2002, 124(4): 374–378. doi: https://doi.org/10.1115/1.1502666

Abstract

View articletitled, Impact Resistance of SM Joints Formed With ICA

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Topics: Adhesives , Copper , Fracture (Materials) , Impact testing , Reliability , Shear (Mechanics) , Shear strength , Solders , Silver , Resistors

Additional Technical Papers

Corrosion Analysis of a Fiber-Optic Transceiver Housing

J. H. Lau, Fellow ASME, C. L. Jiaa, S. J. Erasmus

J. Electron. Packag. December 2002, 124(4): 379–384. doi: https://doi.org/10.1115/1.1510862

Abstract

View articletitled, Corrosion Analysis of a Fiber-Optic Transceiver Housing

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Topics: Corrosion , Fibers , Weight (Mass)

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

Ki-Ju Kang, Seon-Ho Choi, Tae-Sung Bae

J. Electron. Packag. December 2002, 124(4): 385–390. doi: https://doi.org/10.1115/1.1510863

Abstract

View articletitled, Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

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Topics: Fatigue cracks , Fracture (Materials) , Solder joints , Solders , Stress , Fatigue testing , Intermetallic compounds

An Analytical Cure Model for Underfill Epoxies

R. L. Mahajan, Fellow ASME, C. P. Malhotra, R. K. Sharma

J. Electron. Packag. December 2002, 124(4): 391–396. doi: https://doi.org/10.1115/1.1510864

Abstract

View articletitled, An Analytical Cure Model for Underfill Epoxies

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Topics: Epoxy adhesives , Epoxy resins , Hardening (Curing) , Heating , Heat transfer coefficients , Temperature

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu

J. Electron. Packag. December 2002, 124(4): 397–402. doi: https://doi.org/10.1115/1.1510865

Abstract

View articletitled, Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

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Topics: Flip-chip devices , Flow (Dynamics) , Shear strength , Tin , Heating , Flip-chip assemblies , Hardening (Curing) , Solders , Manufacturing , Strength (Materials)

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

J. Lau, Fellow ASME, Z. Mei, S. Pang, C. Amsden, J. Rayner, S. Pan

J. Electron. Packag. December 2002, 124(4): 403–410. doi: https://doi.org/10.1115/1.1512294

Abstract

View articletitled, Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

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Topics: Creep , Fatigue , Fatigue testing , Sealing (Process) , Solders , Stress , Switches , Density , Cycles , Finite element analysis

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Mudasir Ahmad, Suresh K. Sitaraman

J. Electron. Packag. December 2002, 124(4): 411–418. doi: https://doi.org/10.1115/1.1512296

Abstract

View articletitled, Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

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Topics: Springs , Stress

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

Marc Hodes, Randy D. Weinstein, Stephen J. Pence, Jason M. Piccini, Lou Manzione, Calvin Chen

J. Electron. Packag. December 2002, 124(4): 419–426. doi: https://doi.org/10.1115/1.1523061

Abstract

View articletitled, Transient Thermal Management of a Handset Using Phase Change Material (PCM)

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Topics: Heat transfer , Natural convection , Phase change materials , Steady state , Temperature , Thermal management , Transients (Dynamics) , Radiation (Physics) , Thermocouples , Heat

Announcement

First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability

J. Electron. Packag. December 2002, 124(4): 432. doi: https://doi.org/10.1115/1.1510861

Extract

View articletitled, First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability

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Topics: Electronic products , Liabilities , Reliability , Telecommunications , Testing

Editorial

Special Issue on Poly’2000, London

Technical Papers

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

Study on Failure Mechanism of PCT Reliability for BT Substrate Based CSP (Chip Scale Package)

Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

Optical Measurements of Shrinkage in UV-Cured Adhesives

Application of Ice Particles for Precision Cleaning of Sensitive Surfaces

Chemical-Mechanical Planarization of Low- $k$ Polymers for Advanced IC Structures

Electrically Conductive Adhesive Formulations for SMT Applications

Study of P-V-T-C Relation of EMC

Impact Resistance of SM Joints Formed With ICA

Additional Technical Papers

Corrosion Analysis of a Fiber-Optic Transceiver Housing

Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints

An Analytical Cure Model for Underfill Epoxies

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

Study of Mechanical Behavior of Compliant Micro-Springs for Next Generation Probing Applications

Transient Thermal Management of a Handset Using Phase Change Material (PCM)

Announcement

First Call for Papers: International IEEE Conference on the Business of Electronic Product Reliability and Liability

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