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Volume 131, Issue 3

September 2009

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Research Papers
Technical Briefs

Research Papers

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Fei Qin, Tong An, Na Chen, Jie Bai

J. Electron. Packag. September 2009, 131(3): 031001. doi: https://doi.org/10.1115/1.3144151

Abstract

View articletitled, Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

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Topics: Fractography , Lead-free solders , Solders , Tensile strength , Reliability , Electronic products , Solder joints , Stress-strain curves

Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package

S. Abdullah, M. F. Abdullah, A. K. Ariffin, A. Jalar

J. Electron. Packag. September 2009, 131(3): 031002. doi: https://doi.org/10.1115/1.3144155

Abstract

View articletitled, Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package

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Topics: Delamination , Fracture (Materials) , Oxidation , Reliability , Shear (Mechanics) , Statistical analysis , Copper , Stress

In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

Ben-Je Lwo, Jeng-Shian Su, Hsien Chung

J. Electron. Packag. September 2009, 131(3): 031003. doi: https://doi.org/10.1115/1.3144149

Abstract

View articletitled, In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

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Topics: Sensors , Simulation , Stress , Temperature , Packaging , Finite element analysis , Temperature sensors

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

V. Egan, P. A. Walsh, E. Walsh, R. Grimes

J. Electron. Packag. September 2009, 131(3): 031004. doi: https://doi.org/10.1115/1.3144150

Abstract

View articletitled, Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

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Topics: Design , Flow (Dynamics) , Heat sinks , Cooling , Thermal resistance , Fans , Fins

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Satoru Katsurayama, Hironori Tohmyoh

J. Electron. Packag. September 2009, 131(3): 031005. doi: https://doi.org/10.1115/1.3144153

Abstract

View articletitled, Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

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Topics: Flip-chip packages , Hardening (Curing) , Manufacturing , Reliability , Temperature , Warping , Flow (Dynamics) , Flip-chip devices

Laser-Based Target Preparation in 3D Integrated Electronic Packages

Stefan Martens, Walter Mack, Frédéric Courtade, Philippe Perdu, Juergen Wilde, Friedemann Voelklein

J. Electron. Packag. September 2009, 131(3): 031006. doi: https://doi.org/10.1115/1.3144157

Abstract

View articletitled, Laser-Based Target Preparation in 3D Integrated Electronic Packages

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Topics: Lasers , Silicon

Squeezing Flow of a Power Law Fluid Between Grooved Plates

Drew A. Davidson, Bahgat G. Sammakia

J. Electron. Packag. September 2009, 131(3): 031007. doi: https://doi.org/10.1115/1.3144158

Abstract

View articletitled, Squeezing Flow of a Power Law Fluid Between Grooved Plates

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Topics: Flow (Dynamics) , Fluids , Microchannels , Plates (structures) , Flat plates

Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks

Jaeseon Lee, Issam Mudawar

J. Electron. Packag. September 2009, 131(3): 031008. doi: https://doi.org/10.1115/1.3144146

Abstract

View articletitled, Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks

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Topics: Boiling , Flow (Dynamics) , Heat sinks , Microchannels , Pressure drop , Subcooling , Temperature , Two-phase flow

Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment

Pablo D. Quinones, Lawrence S. Mok

J. Electron. Packag. September 2009, 131(3): 031009. doi: https://doi.org/10.1115/1.3153407

Abstract

View articletitled, Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment

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Topics: Copper , Heat , Heat pipes , Heat sinks , Thermal conductivity , Thermal resistance , Cooling , Modeling , Flow (Dynamics) , Finite element analysis

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie, X. J. Fan, X. Q. Shi, H. Ding

J. Electron. Packag. September 2009, 131(3): 031010. doi: https://doi.org/10.1115/1.3144147

Abstract

View articletitled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

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Topics: Diffusion (Physics) , Modeling , Temperature , Vapor pressure , Electronic packages

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

B. Xie, X. J. Fan, X. Q. Shi, H. Ding

J. Electron. Packag. September 2009, 131(3): 031011. doi: https://doi.org/10.1115/1.3144154

Abstract

View articletitled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

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Topics: Diffusion (Physics) , Vapor pressure , Failure , Modeling

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Giulio Lorenzini, Simone Moretti

J. Electron. Packag. September 2009, 131(3): 031012. doi: https://doi.org/10.1115/1.3144152

Abstract

View articletitled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

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Topics: Fins , Heat , Heat exchangers , Pressure , Shapes , Temperature , Thermal conductivity , Ducts , Reynolds number , Optimization

An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer

Lung-Tai Chen, Wood-Hi Cheng

J. Electron. Packag. September 2009, 131(3): 031013. doi: https://doi.org/10.1115/1.3144156

Abstract

View articletitled, An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer

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Topics: Photoresists , Pressure sensors , Packaging , Membranes , Finite element model

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Sangil Lee, M. J. Yim, Daniel Baldwin

J. Electron. Packag. September 2009, 131(3): 031014. doi: https://doi.org/10.1115/1.3153369

Abstract

View articletitled, Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

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Topics: Flip-chip devices , Flow (Dynamics) , Solders , Hardening (Curing) , Chemical reactions , Wetting , Temperature , Flip-chip , Manufacturing

Technical Briefs

An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

Nihad Dukhan

J. Electron. Packag. September 2009, 131(3): 034501. doi: https://doi.org/10.1115/1.3143947

Abstract

View articletitled, An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

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Topics: Convection , Flow (Dynamics) , Fluids , Heat conduction , Porous materials , Temperature , Graphite , Metal foams , Thermal conductivity

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

H. A. Mustain, William D. Brown, Simon S. Ang

J. Electron. Packag. September 2009, 131(3): 034502. doi: https://doi.org/10.1115/1.3153582

Abstract

View articletitled, Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

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Topics: Copper , Diffusion (Physics) , Silicon , Silicon nitride ceramics , Tungsten , Annealing , High temperature , Metals , Temperature , Electron spectroscopy

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Research Papers

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package

In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Laser-Based Target Preparation in 3D Integrated Electronic Packages

Squeezing Flow of a Power Law Fluid Between Grooved Plates

Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks

Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Technical Briefs

An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

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