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Issues
March 2011
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Guest Editorial
Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09
J. Electron. Packag. March 2011, 133(1): 010301.
doi: https://doi.org/10.1115/1.3565444
Topics:
Cooling
,
Electronic packaging
,
Heat transfer
,
Integrated circuits
,
Microchannel flow
Research Papers
Boiling Heat Transfer and Flow Regimes in Microchannels—A Comprehensive Understanding
J. Electron. Packag. March 2011, 133(1): 011001.
doi: https://doi.org/10.1115/1.4002721
Topics:
Boiling
,
Flow (Dynamics)
,
Heat transfer
,
Heat transfer coefficients
,
Microchannels
,
Vapors
,
Pressure drop
,
Heat flux
,
Heat
,
Flux (Metallurgy)
Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a
J. Electron. Packag. March 2011, 133(1): 011002.
doi: https://doi.org/10.1115/1.4001857
Topics:
Cooling
,
Film thickness
,
Heat flux
,
Heat transfer
,
Sprays
,
Refrigerants
,
Critical heat flux
,
Temperature
,
Boiling
Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages
J. Electron. Packag. March 2011, 133(1): 011003.
doi: https://doi.org/10.1115/1.4003217
From Chip to Cooling Tower Data Center Modeling: Influence of Server Inlet Temperature and Temperature Rise Across Cabinet
J. Electron. Packag. March 2011, 133(1): 011004.
doi: https://doi.org/10.1115/1.4003274
Topics:
Cooling
,
Cooling towers
,
Data centers
,
Temperature
,
Cooling systems
,
Heat
,
Modeling
,
Flow (Dynamics)
A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator
J. Electron. Packag. March 2011, 133(1): 011005.
doi: https://doi.org/10.1115/1.4003516
Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance
J. Electron. Packag. March 2011, 133(1): 011006.
doi: https://doi.org/10.1115/1.4003514
Topics:
Brightness (Photometry)
,
Heat
,
Light-emitting diodes
,
Temperature
,
Design
,
Modeling
,
Shapes
Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance
J. Electron. Packag. March 2011, 133(1): 011007.
doi: https://doi.org/10.1115/1.4003603
Topics:
Data centers
,
Flow (Dynamics)
,
Pipes
,
Tiles
,
Computer simulation
,
Air flow
Heat Transfer of an IGBT Module Integrated With a Vapor Chamber
J. Electron. Packag. March 2011, 133(1): 011008.
doi: https://doi.org/10.1115/1.4003214
Topics:
Circuits
,
Copper
,
Heat
,
Heat transfer
,
Junctions
,
Stress
,
Temperature
,
Thermal conductivity
,
Thermal resistance
,
Transients (Dynamics)
Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration
J. Electron. Packag. March 2011, 133(1): 011009.
doi: https://doi.org/10.1115/1.4003216
Topics:
Light-emitting diodes
,
Phosphors
,
Packaging
An Artificial Neural Network Approach to Cooling Analysis of Electronic Components in Enclosures Filled With Nanofluids
J. Electron. Packag. March 2011, 133(1): 011010.
doi: https://doi.org/10.1115/1.4003215
Technical Briefs
Improved Packaging Design for Maximizing the Thermal Performance of Multifinger Collector-Up HBTs
J. Electron. Packag. March 2011, 133(1): 014501.
doi: https://doi.org/10.1115/1.4003515
Topics:
Design
,
Gallium arsenide
,
Genetic algorithms
,
Optimization
,
Packaging
,
Thermal resistance
,
Transistors
,
Thermal stability
,
Thermal management
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Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
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