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Issues
December 2022
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Review Article
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review
J. Electron. Packag. December 2022, 144(4): 040801.
doi: https://doi.org/10.1115/1.4054184
Topics:
Boiling
,
Bubbles
,
Critical heat flux
,
Heat transfer
,
Pool boiling
,
Pressure
,
Nucleation (Physics)
,
Fluids
,
Water
,
Heat
Research Papers
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
J. Electron. Packag. December 2022, 144(4): 041001.
doi: https://doi.org/10.1115/1.4052075
Topics:
Fatigue
,
Solders
,
Tin
,
Displacement
,
Fracture (Materials)
,
Intermetallic compounds
,
Packaging
,
Reliability
,
Temperature
Coupled Calculations of Data Center Cooling and Power Distribution Systems
J. Electron. Packag. December 2022, 144(4): 041002.
doi: https://doi.org/10.1115/1.4052101
Topics:
Cooling
,
Cooling systems
,
Data centers
,
Power systems (Machinery)
,
Stress
,
Energy efficiency
,
Electronic systems
,
Uncertainty
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
J. Electron. Packag. December 2022, 144(4): 041003.
doi: https://doi.org/10.1115/1.4052275
Topics:
Computational fluid dynamics
,
Flip-chip
,
Flip-chip packages
,
Flow (Dynamics)
,
Simulation
,
Solders
,
Surface energy
,
Uncertainty
,
Shapes
,
Packaging
Design of Microfabricated Mechanically Interlocking Metamaterials for Reworkable Heterogeneous Integration
J. Electron. Packag. December 2022, 144(4): 041004.
doi: https://doi.org/10.1115/1.4052325
Topics:
Cantilevers
,
Design
,
Deflection
,
Microfabrication
,
Metamaterials
,
Modeling
,
Finite element analysis
,
Stress
Design and Fabrication of Leadless Package Structure for Pressure Sensors
Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
J. Electron. Packag. December 2022, 144(4): 041005.
doi: https://doi.org/10.1115/1.4052246
Topics:
Design
,
Glass
,
Manufacturing
,
Pressure
,
Pressure sensors
,
Silver
,
Thermal stresses
,
Bonding
,
Stress
,
Temperature
Influence of Laser Soldering Temperatures on Through-Hole Component
J. Electron. Packag. December 2022, 144(4): 041006.
doi: https://doi.org/10.1115/1.4052175
Topics:
Flow (Dynamics)
,
Lasers
,
Soldering
,
Solders
,
Temperature
,
Lead-free solders
,
Finite volume methods
,
Pressure
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel
J. Electron. Packag. December 2022, 144(4): 041007.
doi: https://doi.org/10.1115/1.4052537
Topics:
Bifurcation
,
Flow (Dynamics)
,
Heat transfer
,
Microchannels
,
Fluids
,
Entropy
,
Pressure drop
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers
Pardeep Shahi, Apruv Pravin Deshmukh, Hardik Yashwant Hurnekar, Satyam Saini, Pratik Bansode, Rajesh Kasukurthy, Dereje Agonafer
J. Electron. Packag. December 2022, 144(4): 041008.
doi: https://doi.org/10.1115/1.4052324
Topics:
Computational fluid dynamics
,
Cooling
,
Design
,
Flow (Dynamics)
,
Flow control
,
Valves
,
Pressure drop
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package
J. Electron. Packag. December 2022, 144(4): 041009.
doi: https://doi.org/10.1115/1.4052920
Topics:
Design
,
Flip-chip packages
,
Flow (Dynamics)
,
Optimization
,
Fluids
,
Computer simulation
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing
J. Electron. Packag. December 2022, 144(4): 041010.
doi: https://doi.org/10.1115/1.4053309
Topics:
Failure
,
Shear (Mechanics)
,
Testing
,
Finite element analysis
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
J. Electron. Packag. December 2022, 144(4): 041011.
doi: https://doi.org/10.1115/1.4053310
Topics:
Boiling
,
Cooling
,
Heat
,
Heat transfer coefficients
,
Temperature
,
Critical heat flux
,
Temperature distribution
,
Flat heat pipes
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
J. Electron. Packag. December 2022, 144(4): 041012.
doi: https://doi.org/10.1115/1.4053365
Topics:
Damage
,
Density
,
Electric current
,
Inks
,
Nanoparticles
,
Reliability
,
Lasers
,
Diffusion (Physics)
,
Atoms
,
Grain boundaries
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
J. Electron. Packag. December 2022, 144(4): 041013.
doi: https://doi.org/10.1115/1.4053432
Topics:
Epoxy resins
,
Pressure
,
Silver
,
Sintering
,
Temperature
,
Reliability
,
Shear strength
,
Epoxy adhesives
,
Shear (Mechanics)
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator
J. Electron. Packag. December 2022, 144(4): 041014.
doi: https://doi.org/10.1115/1.4053433
Topics:
Flow (Dynamics)
,
Heat sinks
,
Heat transfer
,
Methane
,
Microchannels
,
Pressure
,
Electromechanical actuators
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
J. Electron. Packag. December 2022, 144(4): 041015.
doi: https://doi.org/10.1115/1.4053643
Topics:
Air flow
,
Design
,
Stress
,
Flow (Dynamics)
,
Control systems
,
Heat
,
Data centers
,
Inertia (Mechanics)
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
J. Electron. Packag. December 2022, 144(4): 041016.
doi: https://doi.org/10.1115/1.4054096
Topics:
Fracture (Materials)
,
Fracture (Process)
,
Intermetallic compounds
,
Solder joints
,
Solders
,
Tin
,
Reliability
,
Fractography
,
Lead-free solders
,
Failure
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
J. Electron. Packag. December 2022, 144(4): 041017.
doi: https://doi.org/10.1115/1.4054183
Topics:
Deformation
,
Electrical resistance
,
Fatigue
,
Metals
,
Molding
,
Polymers
,
Reliability
,
Silicon
,
Simulation
,
Stress
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation
Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani
J. Electron. Packag. December 2022, 144(4): 041018.
doi: https://doi.org/10.1115/1.4054132
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
J. Electron. Packag. December 2022, 144(4): 041019.
doi: https://doi.org/10.1115/1.4054263
Topics:
Resolution (Optics)
,
Temperature
,
Thermography
,
Deformation
,
Temperature measurement
,
Emissivity
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Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
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