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Issues
June 2025
In Progress
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag. June 2025, 147(2): 021001.
doi: https://doi.org/10.1115/1.4067137
Topics:
Deformation
,
Density
,
Finite element analysis
,
Solders
,
Stress
,
Thermomechanics
,
Creep
,
Simulation
,
Alloys
,
Hardening
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag. June 2025, 147(2): 021002.
doi: https://doi.org/10.1115/1.4067189
Topics:
Current density
,
Electrodiffusion
,
Fatigue
,
Reliability
,
Solder joints
,
Stress
,
Temperature
,
Spectral energy distribution
,
Vehicles
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads
Bharath Ramakrishnan, Cam Turner, Husam Alissa, Dennis Trieu, Felipe Rivera, Luke Melton, Muralikrishna Rao, Sruti Chigullapalli, Tatek Getachew, Vladimir Prodanovic, Robert Lankston, Christian Belady, Vaidehi Oruganti
J. Electron. Packag. June 2025, 147(2): 021003.
doi: https://doi.org/10.1115/1.4067136
Topics:
Artificial intelligence
,
Cooling
,
Data centers
,
Energy consumption
,
Graphics processing units
,
Machine learning
,
Temperature
,
Stress
,
Coolants
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate
J. Electron. Packag. June 2025, 147(2): 021004.
doi: https://doi.org/10.1115/1.4067269
Topics:
Capacitance
,
Ceramics
,
Circuits
,
Skin effect
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)
J. Electron. Packag. June 2025, 147(2): 021005.
doi: https://doi.org/10.1115/1.4067377
Topics:
Condensation
,
Condensers (steam plant)
,
Flow (Dynamics)
,
Fluids
,
Friction
,
Heat exchangers
,
Pressure
,
Refrigerants
,
Temperature
,
Heat transfer
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging
J. Electron. Packag. June 2025, 147(2): 021006.
doi: https://doi.org/10.1115/1.4067266
Topics:
Batteries
,
Cycles
,
Simulation
,
Stress
,
Engineering simulation
,
Lithium-ion batteries
,
Electrodes
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag. June 2025, 147(2): 021007.
doi: https://doi.org/10.1115/1.4067650
Topics:
Compacting
,
Electronic components
,
Epoxy resins
,
Printed circuit boards
,
Shock (Mechanics)
,
Surface roughness
,
Testing
,
Modeling
,
Failure
,
Stress
Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag. June 2025, 147(2): 021008.
doi: https://doi.org/10.1115/1.4067651
Topics:
Bonding
,
Convection
,
Copper
,
Electroplating
,
Flow (Dynamics)
,
Current density
,
Columns (Structural)
Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics
Ercan M. Dede, Feng Zhou, Yuqing Zhou, Danny J. Lohan, Mehdi Asheghi, Kenneth E. Goodson, Kris Erickson
J. Electron. Packag. June 2025, 147(2): 021009.
doi: https://doi.org/10.1115/1.4067649
Topics:
Additive manufacturing
,
Ceramics
,
Design
,
Electronics
,
Heat sinks
,
Manifolds
,
Manufacturing
,
Metals
,
Polymers
,
Cooling
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation
J. Electron. Packag. June 2025, 147(2): 021010.
doi: https://doi.org/10.1115/1.4067775
Topics:
Cooling
,
Heat
,
Temperature
,
Thermoelectric coolers
,
Thermoelectricity
,
Design
,
Simulation
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Enhancing Image Segmentation Model in Computing Void Percentage With Mask RCNN
J. Electron. Packag (September 2025)
Sub-millimeter Reflector for Edge-Emitting Laser Package
J. Electron. Packag
