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About the Journal

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems

Frequency: Quarterly

ISSN: 1043-7398
eISSN: 1528-9044

Title History
Journal of Electronic Packaging (ISSN: 1043-7398), 1989 - Present

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Impact Factor: 1.787
2019 Journal Citation Reports ®
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