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Journal Articles

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

Ian Chin, Wei Keat Loh, Seow Chien Kee, Yi He, Mohd. Zulkifly Abdullah, Masahiro Tsuriya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011009.
Paper No: EP-23-1055
https://doi.org/10.1115/1.4066083
Published Online: August 24, 2024
View Article titled, Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
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Topics: Absorption, Epoxy resins, High temperature, Temperature, Thermal expansion
Journal Articles

Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging

Jia-Sheng Li, Yong Tang, Zong-Tao Li, Wen-Quan Kang, Xin-Rui Ding, Bin-Hai Yu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041006.
Paper No: EP-18-1071
https://doi.org/10.1115/1.4044475
Published Online: September 19, 2019
View Article titled, Study on Reabsorption Properties of Quantum Dot Color Convertors for Light-Emitting Diode Packaging
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Topics: Light-emitting diodes, Quantum dots, Packaging, Absorption, Light sources
Journal Articles

Display Light Guide Swelling Due to Moisture Absorption

A. K. Cousins, G. H. Thiel, E. Wolak, G. Limaye, S. Tiku
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041006.
Paper No: EP-17-1070
https://doi.org/10.1115/1.4037971
Published Online: October 5, 2017
View Article titled, Display Light Guide Swelling Due to Moisture Absorption
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Topics: Absorption, Diffusion (Physics), Water, Water absorption, Polymers
Journal Articles

Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures

Changsoo Jang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011013.
Paper No: EP-13-1091
https://doi.org/10.1115/1.4026626
Published Online: February 18, 2014
View Article titled, Hygrothermal Behavior of Advanced Polymers Above Water Boiling Temperatures
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Topics: Boiling, Polymers, Temperature, Water, Weight (Mass), Glass transition, Absorption
Journal Articles

Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants

Sarah Kim, Yoon Jo Kim, Yogendra K. Joshi, Andrei G. Fedorov, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031009.
https://doi.org/10.1115/1.4007111
Published Online: July 23, 2012
View Article titled, Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
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Topics: Absorption, Fluids, Heat pumps, Refrigerants, Refrigeration, Temperature, Pressure, Cooling, Heat
Journal Articles

Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package

Z. Kornain, A. Jalar, R. Rasid, S. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
https://doi.org/10.1115/1.4002741
Published Online: December 8, 2010
View Article titled, Comparative Study of Phenolic-Based and Amine-Based Underfill Materials in Flip Chip Plastic Ball Grid Array Package
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Topics: Absorption, Adhesion, Flip-chip, Flip-chip devices, Fracture toughness, Packaging, Reliability, Shear (Mechanics), Temperature, Young's modulus
Journal Articles

Moisture Absorption and Diffusion Characterization of Molding Compound

Xu Chen, Shufeng Zhao, Linda Zhai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
https://doi.org/10.1115/1.2065707
Published Online: January 21, 2005
View Article titled, Moisture Absorption and Diffusion Characterization of Molding Compound
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Topics: Absorption, Diffusion (Physics), Molding
Journal Articles

Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

Timothy Ferguson, Mem. ASME, Jianmin Qu, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 24–30.
https://doi.org/10.1115/1.1524132
Published Online: March 14, 2003
View Article titled, Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials
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Topics: Absorption, Diffusion (Physics), Fracture (Materials), Fracture (Process), Resins, Fracture toughness
Journal Articles

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
https://doi.org/10.1115/1.1525244
Published Online: March 14, 2003
View Article titled, Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
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Topics: Absorption, Corners (Structural elements), Fracture (Materials), Molding resins, Reflow soldering, Stress, Vapor pressure, Diffusion (Physics), Finite element methods
Journal Articles

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Timothy Ferguson, Member ASME, Jianmin Qu, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 106–110.
https://doi.org/10.1115/1.1414133
Published Online: May 2, 2002
View Article titled, Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface
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Topics: Absorption, Adhesion, Fracture (Materials), Fracture toughness, Solder masks, Delamination, Stress, Flow (Dynamics), Fracture (Process)
Journal Articles

Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

H. Fre´mont, J. Y. Dele´tage, A. Pintus, Y. Danto
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
https://doi.org/10.1115/1.1326436
Published Online: January 1, 2000
View Article titled, Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages
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Topics: Diffusion (Physics), Molding, Resins, Water, Polymers, Diffusion processes, Weight (Mass), Ceramics, Finite element analysis, Geometry
Journal Articles

In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive

A. S. Voloshin, P.-H. Tsao, R. A. Pearson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 1998, 120(3): 314–318.
https://doi.org/10.1115/1.2792639
Published Online: September 1, 1998
View Article titled, In Situ Evaluation of Residual Stresses in an Organic Die-Attach Adhesive
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Topics: Adhesives, Residual stresses, Epoxy adhesives, Epoxy resins, Stress, Hardening (Curing), Absorption, Cooling, Interferometry, Relaxation (Physics)