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Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi

J. Electron. Packag. March 2019, 141(1): 011002.

Paper No: EP-18-1029

DOI: https://doi.org/10.1115/1.4041666

Published Online: February 25, 2019

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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles

Journal Articles

Intermittent Failures in Hardware and Software

Roozbeh Bakhshi, Surya Kunche, Michael Pecht

J. Electron. Packag. March 2014, 136(1): 011014.

Paper No: EP-13-1111

DOI: https://doi.org/10.1115/1.4026639

Published Online: February 18, 2014

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Topics: Computer software, Failure, Hardware

Journal Articles

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Huy N. Phan, Dereje Agonafer

J. Electron. Packag. September 2011, 133(3): 031003.

DOI: https://doi.org/10.1115/1.4004847

Published Online: September 14, 2011

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Topics: Cooling, Currents, Design, Heat, Heat sinks, Temperature, Thermoelectric coolers, Thermoelectric cooling, Cooling systems, Computer software

Journal Articles

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, E. Scott

J. Electron. Packag. December 2004, 126(4): 477–490.

DOI: https://doi.org/10.1115/1.1827264

Published Online: January 24, 2005

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Topics: Capacitance, Electronics, Heat transfer, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Computer software, Heat, Design

Journal Articles

Highlights from the European Thermal Project PROFIT

Clemens J. M. Lasance

J. Electron. Packag. December 2004, 126(4): 565–570.

DOI: https://doi.org/10.1115/1.1827258

Published Online: January 24, 2005

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Topics: Modeling, Reliability, Safety, Steady state, Temperature, Computer software, Electronic products, Temperature gradient

Journal Articles

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. Davies

J. Electron. Packag. March 2003, 125(1): 76–83.

DOI: https://doi.org/10.1115/1.1533060

Published Online: March 14, 2003

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Topics: Computer software, Flow (Dynamics), Forced convection, Heat transfer, Junctions, Modeling, Temperature, Thermal conductivity, Errors, Computational fluid dynamics

Journal Articles

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

D. Vogel, R. Ku¨hnert, M. Dost, B. Michel

J. Electron. Packag. December 2002, 124(4): 345–351.

DOI: https://doi.org/10.1115/1.1506698

Published Online: December 12, 2002

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Topics: Atomic force microscopy, Deformation, Displacement, Displacement measurement, Flip-chip devices, Fracture (Materials), Materials properties, Packaging, Reliability, Stress

Journal Articles

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Dagmar Beyerlein, Lee E. Hornberger

J. Electron. Packag. December 2001, 123(4): 366–371.

DOI: https://doi.org/10.1115/1.1388562

Published Online: February 6, 2001

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Topics: Cavities, Design, Flow (Dynamics), Molding, Resins, Simulation, Wire, Deformation, Computer software, Gates (Closures)

Journal Articles

Software “Reliability”?

Robert S. Hanmer

J. Electron. Packag. December 2000, 122(4): 357–360.

DOI: https://doi.org/10.1115/1.1289630

Published Online: January 26, 2000

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Topics: Computer software, Errors, Hardware, Reliability, Failure

Journal Articles

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

L. Nguyen, C. Quentin, W. Lee, S. Bayyuk, S. A. Bidstrup-Allen, S.-T. Wang

J. Electron. Packag. June 2000, 122(2): 138–146.

DOI: https://doi.org/10.1115/1.483146

Published Online: September 21, 1999

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Topics: Cavities, Flow (Dynamics), Molding, Pressure, Simulation, Temperature, Transfer molding, Viscosity, Computer simulation, Computer software

Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt

J. Electron. Packag. June 1998, 120(2): 141–144.

DOI: https://doi.org/10.1115/1.2792601

Published Online: June 1, 1998

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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation

Journal Articles

Dynamic Aspects of Wetting Balance Tests

K. W. Moon, W. J. Boettinger, M. E. Williams, D. Josell, B. T. Murray, W. C. Carter, C. A. Handwerker

J. Electron. Packag. September 1996, 118(3): 174–183.

DOI: https://doi.org/10.1115/1.2792149

Published Online: September 1, 1996

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Topics: Wetting, Plates (structures), Fluids, Glass, Shapes, Solders, Computer software, Equilibrium (Physics), Flow (Dynamics), Shear stress

Journal Articles

Comparison of LCC Solder Joint Life Predictions With Experimental Data

Liang-chi Wen, Ronald G. Ross, Jr.

J. Electron. Packag. June 1995, 117(2): 109–115.

DOI: https://doi.org/10.1115/1.2792076

Published Online: June 1, 1995

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Topics: Solder joints, Algorithms, Pins (Engineering), Stress, Temperature, Failure, Electronic packaging, Fatigue, Ceramics, Computer software

Journal Articles

Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

Pardeep K. Bhatti, Klaus Gschwend, Abel Y. Kwang, Ahmer R. Syed

J. Electron. Packag. March 1995, 117(1): 20–25.

DOI: https://doi.org/10.1115/1.2792063

Published Online: March 1, 1995

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Topics: Creep, Solder joints, Surface mount devices, Finite element analysis, Computer software, Degrees of freedom, Materials properties, Surface mount components

Journal Articles

Methodology for Automated Design of Microelectronic Packages

S. D. Rajan, V. Sarihan, M. Mahalingam

J. Electron. Packag. December 1994, 116(4): 274–281.

DOI: https://doi.org/10.1115/1.2905698

Published Online: December 1, 1994

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Topics: Design, Nonlinear programming, Computer software, Design methodology, Finite element analysis, Packaging, Design sensitivity analysis, Electronic packages, Electronic packaging, Equipment performance

Journal Articles

Crack Propagation in Solder Joints During Thermal-Mechanical Cycling

Ronald G. Ross, Jr., Liang-chi Wen

J. Electron. Packag. June 1994, 116(2): 69–75.

DOI: https://doi.org/10.1115/1.2905507

Published Online: June 1, 1994

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Topics: Crack propagation, Solder joints, Failure, Creep, Cycles, Finite element analysis, Fracture (Materials), Solders, Computer software, Cracking (Materials)

Journal Articles

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

S. M. Heinrich, P. E. Liedtke, N. J. Nigro, A. F. Elkouh, P. S. Lee

J. Electron. Packag. December 1993, 115(4): 433–439.

DOI: https://doi.org/10.1115/1.2909353

Published Online: December 1, 1993

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Topics: Geometry, Solder joints, Solders, Density, Gravity (Force), Printed circuit boards, Computer software, Computers, Design, Engineers

Journal Articles

Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

A. Hadim, N. J. Nagurny

J. Electron. Packag. September 1992, 114(3): 300–304.

DOI: https://doi.org/10.1115/1.2905454

Published Online: September 1, 1992

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Topics: Design, Cavities, Computer software, Heat conduction, Heat transfer, Network models, Solders, Thermal analysis

Journal Articles

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

R. G. Ross, Jr., L. C. Wen, G. R. Mon, E. Jetter

J. Electron. Packag. June 1992, 114(2): 185–192.

DOI: https://doi.org/10.1115/1.2906416

Published Online: June 1, 1992

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Topics: Creep, Fatigue, Solders, Computer software, Cycles, Stress, Temperature, Accounting, Algorithms, Deflection

Journal Articles

Structural Analyses of Spacecraft Electronic Packages

S. Kannappan, V. Kunukkassril

J. Electron. Packag. March 1992, 114(1): 96–99.

DOI: https://doi.org/10.1115/1.2905449

Published Online: March 1, 1992

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Topics: Electronic packages, Space vehicles, Structural analysis, Finite element methods, Stress, Computer software, Design, Electronics, Manufacturing, Modal analysis

Journal citation

NARROW

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Intermittent Failures in Hardware and Software

Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

Highlights from the European Thermal Project PROFIT

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept

Software “Reliability”?

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Dynamic Aspects of Wetting Balance Tests

Comparison of LCC Solder Joint Life Predictions With Experimental Data

Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices

Methodology for Automated Design of Microelectronic Packages

Crack Propagation in Solder Joints During Thermal-Mechanical Cycling

Effect of Chip and Pad Geometry on Solder Joint Formation in SMT

Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules

Solder Creep-Fatigue Interactions With Flexible Leaded Parts

Structural Analyses of Spacecraft Electronic Packages

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