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Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

T.-C. Huang, K.-C. Liao

J. Electron. Packag. March 2023, 145(1): 011206.

Paper No: EP-22-1010

DOI: https://doi.org/10.1115/1.4054822

Published Online: August 3, 2022

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Topics: Shock (Mechanics), Contact resistance, Displacement

Journal Articles

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi

J. Electron. Packag. June 2022, 144(2): 021114.

Paper No: EP-21-1052

DOI: https://doi.org/10.1115/1.4053121

Published Online: February 7, 2022

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Topics: Engines, Finite element analysis, Lamination, Motors, Stators, Temperature, Thermal conductivity, Winding (process), Sensitivity analysis, Contact resistance

Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang

J. Electron. Packag. March 2020, 142(1): 014502.

Paper No: EP-19-1039

DOI: https://doi.org/10.1115/1.4044774

Published Online: September 24, 2019

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Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks

Journal Articles

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps

Sung Woo Ma, Chanho Shin, Young-Ho Kim

J. Electron. Packag. December 2017, 139(4): 041004.

Paper No: EP-17-1044

DOI: https://doi.org/10.1115/1.4037474

Published Online: September 5, 2017

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Topics: Bonding, Contact resistance, Electrodiffusion, Shear strength, Temperature, Heating, Joules

Journal Articles

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Santosh V. Angadi, Robert L. Jackson, Song-yul Choe, George T. Flowers, Bong-Yi Lee, Liang Zhong

J. Electron. Packag. March 2012, 134(1): 011001.

DOI: https://doi.org/10.1115/1.4005955

Published Online: March 19, 2012

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Topics: Cables, Contact resistance, Finite element model, Heating, Surface roughness, Temperature, Joules, Current density, Stress, Flow (Dynamics)

Journal Articles

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Feng Gao, Jianmin Qu, Matthew Yao

J. Electron. Packag. June 2011, 133(2): 020908.

DOI: https://doi.org/10.1115/1.4004095

Published Online: July 1, 2011

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Topics: Carbon nanotubes, Contact resistance, Electrodes, Electron configuration

Journal Articles

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

Jianhua Zhang, Jinsong Zhang, Lianqiao Yang

J. Electron. Packag. December 2010, 132(4): 044501.

DOI: https://doi.org/10.1115/1.4002898

Published Online: December 3, 2010

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Topics: Bonding, Contact resistance, Packaging, Tin, Temperature, Pressure, Glass, High temperature, Melting point

Journal Articles

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

Christopher T. DeGroot, Derek Gateman, Anthony G. Straatman

J. Electron. Packag. December 2010, 132(4): 041007.

DOI: https://doi.org/10.1115/1.4002724

Published Online: November 24, 2010

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Topics: Contact resistance, Heat sinks, Heat transfer, Metal foams, Fluids, Fins, Aluminum, Convection, Heat conduction, Epoxy adhesives

Journal Articles

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Myung Jin Yim, Yi Li, Kyoung Sik Moon, C. P. Wong

J. Electron. Packag. March 2010, 132(1): 011007.

DOI: https://doi.org/10.1115/1.4001229

Published Online: March 19, 2010

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Topics: Adhesives, Coating processes, Coatings, Copper, Particulate matter, Contact resistance, Anisotropy, Polymers, Fillers (Materials)

Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber

J. Electron. Packag. June 2008, 130(2): 021006.

DOI: https://doi.org/10.1115/1.2912180

Published Online: May 8, 2008

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Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins

Journal Articles

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

S. Manian Ramkumar, Krishnaswami Srihari

J. Electron. Packag. June 2007, 129(2): 149–156.

DOI: https://doi.org/10.1115/1.2721086

Published Online: August 14, 2006

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Topics: Adhesives, Anisotropy, Ball-Grid-Array packaging, Temperature, Manufacturing, Particulate matter, Shear (Mechanics), Contact resistance, Chain, Magnetic fields

Journal Articles

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Zongrong Liu, D. D. L. Chung

J. Electron. Packag. December 2006, 128(4): 319–323.

DOI: https://doi.org/10.1115/1.2351895

Published Online: June 1, 2006

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Topics: Boron, Contact resistance, Paraffin wax, Particulate matter, Pressure, Temperature, Thermal conductivity, Electrical conductance, Copper

Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann

J. Electron. Packag. June 2006, 128(2): 130–136.

DOI: https://doi.org/10.1115/1.2188952

Published Online: February 14, 2006

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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon

Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu

J. Electron. Packag. September 2006, 128(3): 177–183.

DOI: https://doi.org/10.1115/1.2227057

Published Online: August 7, 2005

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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip

Journal Articles

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

W. K. Chiang, Y. C. Chan

J. Electron. Packag. June 2005, 127(2): 113–119.

DOI: https://doi.org/10.1115/1.1849236

Published Online: June 3, 2005

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Topics: Contact resistance, Reflow soldering, Reliability, Bonding, Adhesives, Temperature, Anisotropy, Testing

Journal Articles

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Rashed Adnan Islam, Y. C. Chan

J. Electron. Packag. December 2005, 127(4): 375–380.

DOI: https://doi.org/10.1115/1.2056570

Published Online: February 14, 2005

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Topics: Anisotropy, Contact resistance, Shock (Mechanics), Particulate matter, Abrasion

Journal Articles

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura

J. Electron. Packag. September 2003, 125(3): 386–391.

DOI: https://doi.org/10.1115/1.1602703

Published Online: September 17, 2003

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Topics: Contact resistance, Particulate matter, Thermal conductivity, Percolation theory, Stiffness, Modeling, Polymers, Fillers (Materials)

Journal Articles

In Honor of Dr. M. M. Yovanovich

J. Electron. Packag. June 2003, 125(2): 165–168.

DOI: https://doi.org/10.1115/1.1568123

Published Online: June 10, 2003

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Topics: Contact resistance, Convection, Engineering teachers, Graduate students, Heat conduction, Heat transfer, Packaging, Students, Thermal resistance, Modeling

Journal Articles

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Wataru Nakayama, Arthur E. Bergles

J. Electron. Packag. June 2003, 125(2): 192–199.

DOI: https://doi.org/10.1115/1.1568127

Published Online: June 10, 2003

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Topics: Contact resistance, Cooling, Electrical conductance, Electronic equipment, Flat heat pipes, Flow (Dynamics), Heat, Heat conduction, Heat sinks, Heat transfer

Journal Articles

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

Zhe Zhang, Graduate Research Assistant,, E. E. Marotta, Senior Engineer/Scientist/Adjunct Professor—Thermal Development,, J. M. Ochterbeck, Associate Professor,

J. Electron. Packag. June 2003, 125(2): 186–191.

DOI: https://doi.org/10.1115/1.1568126

Published Online: June 10, 2003

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Topics: Boundary-value problems, Contact resistance, Cylinders, Stress, Temperature, Thermal conductivity, Model development, Mechanical properties, Dimensions, Contact mechanics

Journal citation

NARROW

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 μ m Cu Microbumps

A Multiphysics Finite Element Model of a 35A Automotive Connector Including Multiscale Rough Surface Contact

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film

The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks

High Performance Anisotropic Conductive Adhesives Using Copper Particles With an Anti-Oxidant Coating Layer

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Reliability of Anisotropic Conductive Film Joints Using Bumpless Chip—Influence of Reflow Soldering and Environmental Testing

Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

In Honor of Dr. M. M. Yovanovich

Thermal Interfacing Techniques for Electronic Equipment—A Perspective

Thermal and Mechanical Model for Rigid Cylinder Indenting an Elastic Layer Resting on Rigid Base: Application to Turned Surfaces

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