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Journal Articles

Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034502.
Paper No: EP-22-1028
https://doi.org/10.1115/1.4064604
Published Online: March 7, 2024
View Article titled, Epoxy-Printed Circuit Board Interfacial Fracture Reliability Under Three-Point and Four-Point Bend Loading After Sustained Elevated Temperature Exposure
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Topics: Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Delamination, Temperature, Reliability, Printed circuit boards
Journal Articles

Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging

Meng-Kai Shih, Guan-Sian Lin, Jonny Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031002.
Paper No: EP-23-1072
https://doi.org/10.1115/1.4064355
Published Online: January 12, 2024
View Article titled, Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging
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Topics: Delamination, Diffusion (Physics), Fracture (Materials), Manufacturing, Stress, Temperature, Design, Adhesion, Thermal stresses, Modeling
Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020802.
Paper No: EP-20-1043
https://doi.org/10.1115/1.4048011
Published Online: September 3, 2020
View Article titled, A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones
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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings
Journal Articles

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Guoyi Li, Hyunseong Lee, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011002.
Paper No: EP-19-1077
https://doi.org/10.1115/1.4047228
Published Online: June 4, 2020
View Article titled, Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
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Topics: Delamination, Inspection, Sealants, Signals, Waves, Nondestructive evaluation, Excitation, Integrated circuits
Journal Articles

Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction

David Samet, V. N. N. Trilochan Rambhatla, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021001.
Paper No: EP-19-1032
https://doi.org/10.1115/1.4045706
Published Online: February 3, 2020
View Article titled, Examination of Consistent Application of Interfacial Fracture Energy Versus Mode-Mixity Curve for Delamination Prediction
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Topics: Failure, Fracture (Materials), Fracture (Process), Delamination, Cantilevers
Journal Articles

Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions

Kenny Mahan, David Rosen, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041003.
Paper No: EP-16-1046
https://doi.org/10.1115/1.4034454
Published Online: September 2, 2016
View Article titled, Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions
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Topics: Adhesion, Deflection, Pressure, Testing, Polymer films, Copper, Delamination
Journal Articles

Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure

Hideo Koguchi, Kazuhisa Hoshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020902.
https://doi.org/10.1115/1.4006139
Published Online: June 11, 2012
View Article titled, Evaluation of Joining Strength of Silicon-Resin Interface at a Vertex in a Three-Dimensional Joint Structure
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Topics: Bonding, Boundary element methods, Delamination, Resins, Stress, Stress singularity, Silicon, Joining, Stress concentration
Journal Articles

Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly

Xi Liu, Jiantao Zheng, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
https://doi.org/10.1115/1.4001746
Published Online: June 11, 2010
View Article titled, Hygro-Thermo-Mechanical Reliability Assessment of a Thermal Interface Material for a Ball Grid Array Package Assembly
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Topics: Finite element analysis, Manufacturing, Model validation, Reliability, Temperature, Warping, Laminates, Weight (Mass), Lasers, Thermomechanics
Journal Articles

Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package

Hu Guojun, Andrew A. O. Tay, Luan Jing-En, Ma Yiyi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011006.
https://doi.org/10.1115/1.4001145
Published Online: March 19, 2010
View Article titled, Numerical and Experimental Study of Interface Delamination in Flip Chip BGA Package
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Topics: Ball-Grid-Array packages, Delamination, Flip-chip, Flip-chip devices, Fracture (Materials), Shrinkage (Materials), Stress, Temperature, Epoxy resins, Molding
Journal Articles

Evaluation of Transverse Shear Effect on Film Delamination in Blister Test

Wei Wang, Yong Huang, Nicole Coutris, Hongseok Noh, Peter J. Hesketh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014501.
https://doi.org/10.1115/1.4000717
Published Online: February 25, 2010
View Article titled, Evaluation of Transverse Shear Effect on Film Delamination in Blister Test
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Topics: Delamination, Shear (Mechanics), Film thickness
Journal Articles

Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package

S. Abdullah, M. F. Abdullah, A. K. Ariffin, A. Jalar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031002.
https://doi.org/10.1115/1.3144155
Published Online: June 16, 2009
View Article titled, Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package
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Topics: Delamination, Fracture (Materials), Oxidation, Reliability, Shear (Mechanics), Statistical analysis, Copper, Stress
Journal Articles

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Saketh Mahalingam, Ananth Prabhakumar, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041005.
https://doi.org/10.1115/1.3010378
Published Online: November 17, 2008
View Article titled, Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials
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Topics: Delamination, Flip-chip assemblies, Flow (Dynamics), Thermal shock, Fracture (Materials), Thermomechanics, Fatigue
Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
https://doi.org/10.1115/1.2912188
Published Online: May 9, 2008
View Article titled, On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion
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Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion
Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
View Article titled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
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Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Laura K. Frisk, Kati H. Kokko
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
https://doi.org/10.1115/1.2753909
Published Online: October 27, 2006
View Article titled, Effect of RCC on the Reliability of Adhesive Flip Chip Joints
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Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Particulate matter, Pressure, Reliability, Temperature, Failure, Delamination
Journal Articles

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Saketh Mahalingam, Kunal Goray, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
https://doi.org/10.1115/1.2386242
Published Online: October 4, 2006
View Article titled, Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials
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Topics: Delamination, Fatigue, Fatigue testing, Fracture (Materials), Stress, Thermomechanics, Temperature, Experimental characterization, Fracture (Process), Fracture toughness
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Article titled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation

Woon-Seong Kwon, Myung-Jin Yim, Kyung-Wook Paik, Suk-Jin Ham, Soon-Bok Lee, Member ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 86–90.
https://doi.org/10.1115/1.1846062
Published Online: June 3, 2005
View Article titled, Thermal Cycling Reliability and Delamination of Anisotropic Conductive Adhesives Flip Chip on Organic Substrates With Emphasis on the Thermal Deformation
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Topics: Acoustics, Adhesives, Anisotropy, Deformation, Delamination, Flip-chip devices, Interferometry, Microscopy, Reliability, Thermal deformation
Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
https://doi.org/10.1115/1.2070090
Published Online: January 13, 2005
View Article titled, Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
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Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion
Journal Articles

Interfacial Fracture Toughness Measurement of a Ti/Si Interface

Mitul Modi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
https://doi.org/10.1115/1.1772410
Published Online: October 6, 2004
View Article titled, Interfacial Fracture Toughness Measurement of a Ti/Si Interface
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Topics: Fracture toughness, Stress, Titanium, Silicon, Fracture (Materials), Delamination, Metals, Adhesion, Strips, Adhesives