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Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests

Ming-Yi Tsai, T. C. Kuo

J. Electron. Packag.

Paper No: EP-22-1060

DOI: https://doi.org/10.1115/1.4056717

Published Online: January 23, 2023

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Topics: Bending strength, Silicon, Stress, Buckling, Displacement, Failure mechanisms, Testing

Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen

J. Electron. Packag. June 2023, 145(2): 021003.

Paper No: EP-22-1036

DOI: https://doi.org/10.1115/1.4055125

Published Online: August 18, 2022

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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction

Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

T.-C. Huang, K.-C. Liao

J. Electron. Packag. March 2023, 145(1): 011206.

Paper No: EP-22-1010

DOI: https://doi.org/10.1115/1.4054822

Published Online: August 3, 2022

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Topics: Shock (Mechanics), Contact resistance, Displacement

Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee

J. Electron. Packag. December 2022, 144(4): 041001.

Paper No: EP-21-1043

DOI: https://doi.org/10.1115/1.4052075

Published Online: October 6, 2021

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Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature

Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh

J. Electron. Packag. December 2019, 141(4): 041007.

Paper No: EP-19-1034

DOI: https://doi.org/10.1115/1.4044961

Published Online: October 18, 2019

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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness

Journal Articles

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Chia-Cheng Chang, Sheng-Da Lin, Kuo-Ning Chiang

J. Electron. Packag. September 2018, 140(3): 031008.

Paper No: EP-18-1004

DOI: https://doi.org/10.1115/1.4040297

Published Online: June 26, 2018

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Topics: Stress, High cycle fatigue, Displacement, Silicon, Thin films, Fatigue life

Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou

J. Electron. Packag. December 2016, 138(4): 041001.

Paper No: EP-14-1082

DOI: https://doi.org/10.1115/1.4034187

Published Online: August 10, 2016

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Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems

Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman

J. Electron. Packag. December 2015, 137(4): 041005.

Paper No: EP-14-1064

DOI: https://doi.org/10.1115/1.4031680

Published Online: October 12, 2015

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Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes

Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman

J. Electron. Packag. September 2015, 137(3): 031006.

Paper No: EP-14-1030

DOI: https://doi.org/10.1115/1.4030065

Published Online: September 1, 2015

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Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics

Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen

J. Electron. Packag. June 2015, 137(2): 021012.

Paper No: EP-14-1077

DOI: https://doi.org/10.1115/1.4029441

Published Online: June 1, 2015

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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Raphael Okereke, Karan Kacker, Suresh K. Sitaraman

J. Electron. Packag. September 2013, 135(3): 031004.

Paper No: EP-12-1102

DOI: https://doi.org/10.1115/1.4024112

Published Online: June 4, 2013

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Topics: Manufacturing, Reliability, Stress, Thermomechanics, Displacement, Semiconductor wafers, Copper, Simulation, Solders

Journal Articles

Thermal Performance of an Al 2 O 3 –Water Nanofluid Pulsating Heat Pipe

Hamid Reza Seyf, Sejung Kim, Yuwen Zhang

J. Electron. Packag. September 2013, 135(3): 031005.

Paper No: EP-12-1107

DOI: https://doi.org/10.1115/1.4024145

Published Online: June 4, 2013

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Topics: Displacement, Fluids, Heat pipes, Heat transfer, Latent heat, Nanofluids, Nanoparticles, Particulate matter, Pressure, Slug flows

Journal Articles

Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations

Elham Maghsoudi, Michael James Martin

J. Electron. Packag. June 2013, 135(2): 021011.

Paper No: EP-12-1075

DOI: https://doi.org/10.1115/1.4024012

Published Online: April 12, 2013

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Topics: Heat, Heating, Switches, Displacement, Simulation, Steady state, Bridges (Structures), Boundary-value problems

Journal Articles

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

D. N. Borza, I. T. Nistea

J. Electron. Packag. December 2012, 134(4): 041007.

DOI: https://doi.org/10.1115/1.4007812

Published Online: November 26, 2012

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Topics: Deformation, Failure, Printed circuit board assemblies, Screws, Stress, Vibration, Solder joints, Interferometry, Displacement, Boundary-value problems

Journal Articles

Pull Force and Displacement of Cu/Au Wire Interconnects

J. Lau, S. Wu, J. M. Lau

J. Electron. Packag. December 2012, 134(4): 041002.

DOI: https://doi.org/10.1115/1.4007233

Published Online: August 29, 2012

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Topics: Displacement, Wire

Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon

J. Electron. Packag. September 2012, 134(3): 031010.

DOI: https://doi.org/10.1115/1.4007118

Published Online: July 23, 2012

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Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing

Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl

J. Electron. Packag. December 2011, 133(4): 041004.

DOI: https://doi.org/10.1115/1.4005289

Published Online: December 9, 2011

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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling

Journal Articles

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Tarek Ragab, Cemal Basaran

J. Electron. Packag. June 2011, 133(2): 020903.

DOI: https://doi.org/10.1115/1.4003866

Published Online: June 7, 2011

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Topics: Atoms, Carbon nanotubes, Chain, Displacement, Failure, Molecular dynamics simulation, Nanotubes, Simulation, Single-walled carbon nanotubes, Stress

Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno

J. Electron. Packag. September 2010, 132(3): 031003.

DOI: https://doi.org/10.1115/1.4001854

Published Online: September 9, 2010

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Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels

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Journal citation

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Manuscript

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the BoR and PoEF Tests

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Stress–Strain Behavior of SAC305 at High Strain Rates

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Thermal Performance of an Al 2 O 3 –Water Nanofluid Pulsating Heat Pipe

Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

Pull Force and Displacement of Cu/Au Wire Interconnects

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

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