1-20 of 85
Displacement
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
https://doi.org/10.1115/1.4056717
Published Online: February 8, 2023
View Article titled, A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests
Open the PDF for A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests in another window
Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms
Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
Open the PDF for An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging in another window
Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

T.-C. Huang, K.-C. Liao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011206.
Paper No: EP-22-1010
https://doi.org/10.1115/1.4054822
Published Online: August 3, 2022
View Article titled, Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks
Open the PDF for Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks in another window
Topics: Shock (Mechanics), Contact resistance, Displacement
Journal Articles

Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging

H. T. Lee, C. Y. Ho, C. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
https://doi.org/10.1115/1.4052075
Published Online: October 6, 2021
View Article titled, Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging
Open the PDF for Optimized Design of Various Ag Decorated Sn-xAg-Cu 0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging in another window
Topics: Fatigue, Solders, Tin, Displacement, Fracture (Materials), Intermetallic compounds, Packaging, Reliability, Temperature
Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
https://doi.org/10.1115/1.4044961
Published Online: October 18, 2019
View Article titled, Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses
Open the PDF for Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses in another window
Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness
Journal Articles

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

Chia-Cheng Chang, Sheng-Da Lin, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
https://doi.org/10.1115/1.4040297
Published Online: June 26, 2018
View Article titled, Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures
Open the PDF for Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures in another window
Topics: Stress, High cycle fatigue, Displacement, Silicon, Thin films, Fatigue life
Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041001.
Paper No: EP-14-1082
https://doi.org/10.1115/1.4034187
Published Online: August 10, 2016
View Article titled, Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response
Open the PDF for Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response in another window
Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems
Journal Articles

Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages

Wei Chen, Anirudh Bhat, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041005.
Paper No: EP-14-1064
https://doi.org/10.1115/1.4031680
Published Online: October 12, 2015
View Article titled, Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
Open the PDF for Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages in another window
Topics: Displacement, Manufacturing, Polymers, Simulation, Testing, Accelerometers, Engineering simulation, Strain gages, Finite element analysis, Engineering prototypes
Journal Articles

Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics

R. I. Okereke, S. K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031006.
Paper No: EP-14-1030
https://doi.org/10.1115/1.4030065
Published Online: September 1, 2015
View Article titled, Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics
Open the PDF for Mixed Array of Compliant Interconnects to Balance Mechanical and Electrical Characteristics in another window
Topics: Dimensions, Electrical resistance, Fatigue life, Manufacturing, Solders, Stress, Warping, Cycles, Signals, Thermomechanics
Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021012.
Paper No: EP-14-1077
https://doi.org/10.1115/1.4029441
Published Online: June 1, 2015
View Article titled, Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue
Open the PDF for Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue in another window
Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature
Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
https://doi.org/10.1115/1.4028641
Published Online: March 1, 2015
View Article titled, Stress–Strain Behavior of SAC305 at High Strain Rates
Open the PDF for Stress–Strain Behavior of SAC305 at High Strain Rates in another window
Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)
Journal Articles

Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects

Raphael Okereke, Karan Kacker, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031004.
Paper No: EP-12-1102
https://doi.org/10.1115/1.4024112
Published Online: June 4, 2013
View Article titled, Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects
Open the PDF for Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects in another window
Topics: Manufacturing, Reliability, Stress, Thermomechanics, Displacement, Semiconductor wafers, Copper, Simulation, Solders
Journal Articles

Thermal Performance of an Al 2 O 3 –Water Nanofluid Pulsating Heat Pipe

Hamid Reza Seyf, Sejung Kim, Yuwen Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031005.
Paper No: EP-12-1107
https://doi.org/10.1115/1.4024145
Published Online: June 4, 2013
View Article titled, Thermal Performance of an Al 2 O 3 –Water Nanofluid Pulsating Heat Pipe
Open the PDF for Thermal Performance of an Al 2 O 3 –Water Nanofluid Pulsating Heat Pipe in another window
Topics: Displacement, Fluids, Heat pipes, Heat transfer, Latent heat, Nanofluids, Nanoparticles, Particulate matter, Pressure, Slug flows
Journal Articles

Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations

Elham Maghsoudi, Michael James Martin
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021011.
Paper No: EP-12-1075
https://doi.org/10.1115/1.4024012
Published Online: April 12, 2013
View Article titled, Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations
Open the PDF for Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations in another window
Topics: Heat, Heating, Switches, Displacement, Simulation, Steady state, Bridges (Structures), Boundary-value problems
Journal Articles

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

D. N. Borza, I. T. Nistea
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041007.
https://doi.org/10.1115/1.4007812
Published Online: November 26, 2012
View Article titled, Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level
Open the PDF for Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level in another window
Topics: Deformation, Failure, Printed circuit board assemblies, Screws, Stress, Vibration, Solder joints, Interferometry, Displacement, Boundary-value problems
Journal Articles

Pull Force and Displacement of Cu/Au Wire Interconnects

J. Lau, S. Wu, J. M. Lau
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041002.
https://doi.org/10.1115/1.4007233
Published Online: August 29, 2012
View Article titled, Pull Force and Displacement of Cu/Au Wire Interconnects
Open the PDF for Pull Force and Displacement of Cu/Au Wire Interconnects in another window
Topics: Displacement, Wire
Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031010.
https://doi.org/10.1115/1.4007118
Published Online: July 23, 2012
View Article titled, Effect of Shield-Can on Dynamic Response of Board-Level Assembly
Open the PDF for Effect of Shield-Can on Dynamic Response of Board-Level Assembly in another window
Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Article titled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
Open the PDF for Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections in another window
Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Tarek Ragab, Cemal Basaran
Journal: Journal of Electronic Packaging
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020903.
https://doi.org/10.1115/1.4003866
Published Online: June 7, 2011
View Article titled, The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations
Open the PDF for The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations in another window
Topics: Atoms, Carbon nanotubes, Chain, Displacement, Failure, Molecular dynamics simulation, Nanotubes, Simulation, Single-walled carbon nanotubes, Stress
Journal Articles

Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV

Shin-ichi Satake, Gaku Sorimachi, Takahiro Kanai, Jun Taniguchi, Noriyuki Unno
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
https://doi.org/10.1115/1.4001854
Published Online: September 9, 2010
View Article titled, Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV
Open the PDF for Three-Dimensional Measurements of Photo-curing Process With Photo-curable Resin for UV-Nanoimprint by Micro-digital-Holographic-PTV in another window
Topics: Hardening (Curing), Particulate matter, Resins, Ultraviolet radiation, Glass, Holography, Temperature, Displacement, Microchannels