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Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke

J. Electron. Packag. September 2023, 145(3): 031008.

Paper No: EP-22-1082

DOI: https://doi.org/10.1115/1.4056992

Published Online: March 8, 2023

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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure

Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink

J. Electron. Packag. June 2023, 145(2): 020801.

Paper No: EP-22-1045

DOI: https://doi.org/10.1115/1.4055774

Published Online: October 22, 2022

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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling

Journal Articles

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Mahsa Montazeri, Whit M. Vinson, David R. Huitink

J. Electron. Packag. June 2023, 145(2): 021002.

Paper No: EP-22-1037

DOI: https://doi.org/10.1115/1.4055024

Published Online: August 8, 2022

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Topics: Electrodiffusion, Failure, Solder joints, Solders, Stress, Temperature, Tension, Testing, Current density, Tin

Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2023, 145(1): 011204.

Paper No: EP-21-1110

DOI: https://doi.org/10.1115/1.4054784

Published Online: August 3, 2022

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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure

Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021119.

Paper No: EP-21-1057

DOI: https://doi.org/10.1115/1.4054131

Published Online: April 22, 2022

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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature

Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim

J. Electron. Packag. December 2022, 144(4): 041017.

Paper No: EP-21-1014

DOI: https://doi.org/10.1115/1.4054183

Published Online: April 22, 2022

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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress

Includes: Supplementary data

Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla

J. Electron. Packag. December 2022, 144(4): 041016.

Paper No: EP-21-1159

DOI: https://doi.org/10.1115/1.4054096

Published Online: March 31, 2022

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Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure

Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021117.

Paper No: EP-21-1066

DOI: https://doi.org/10.1115/1.4053766

Published Online: March 11, 2022

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Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver

Journal Articles

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Qiming Zhang, S. W. Ricky Lee

J. Electron. Packag. December 2022, 144(4): 041010.

Paper No: EP-21-1030

DOI: https://doi.org/10.1115/1.4053309

Published Online: January 28, 2022

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Topics: Failure, Shear (Mechanics), Testing, Finite element analysis

Journal Articles

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Pradeep Lall, Tony Thomas, Ken Blecker

J. Electron. Packag. June 2022, 144(2): 021111.

Paper No: EP-21-1067

DOI: https://doi.org/10.1115/1.4052630

Published Online: December 1, 2021

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Topics: Failure, Service life (Equipment), Signals, Temperature, Vibration, Principal component analysis

Journal Articles

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

A. Otto, E. Kaulfersch, P. Singh, C. Romano, M. Hildebrandt, S. Rzepka

J. Electron. Packag. June 2022, 144(2): 021106.

Paper No: EP-21-1010

DOI: https://doi.org/10.1115/1.4052070

Published Online: October 6, 2021

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Topics: Failure, Fatigue, Printed circuit boards, Resistors, Simulation, Solder joints, Solders, Stress, Thermomechanics, Warping

Journal Articles

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Manu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi

J. Electron. Packag. September 2022, 144(3): 031001.

Paper No: EP-20-1111

DOI: https://doi.org/10.1115/1.4051620

Published Online: September 15, 2021

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Topics: Fatigue, Solder joints, Stiffness, Stress, Temperature, Failure, Deformation, Manufacturing, Shear (Mechanics)

Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler

J. Electron. Packag. September 2022, 144(3): 030801.

Paper No: EP-20-1054

DOI: https://doi.org/10.1115/1.4051255

Published Online: September 15, 2021

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Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure

Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis

J. Electron. Packag. March 2022, 144(1): 011003.

Paper No: EP-20-1083

DOI: https://doi.org/10.1115/1.4050696

Published Online: August 6, 2021

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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis

Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman

J. Electron. Packag. March 2022, 144(1): 011009.

Paper No: EP-20-1126

DOI: https://doi.org/10.1115/1.4050898

Published Online: August 6, 2021

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Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density

Journal Articles

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

Pradeep Lall, Amrit Abrol, Nakul Kothari, Benjamin Leever, Scott Miller

J. Electron. Packag. December 2020, 142(4): 041003.

Paper No: EP-20-1001

DOI: https://doi.org/10.1115/1.4048535

Published Online: October 12, 2020

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Topics: Aerosols, Electrical resistivity, Failure, Inks, Shear (Mechanics), Sintering, Stress, Temperature, Elastic moduli, Printing

Journal Articles

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

Ali Nematollahisarvestani, Yung-Cheng “Y. C.” Lee

J. Electron. Packag. June 2021, 143(2): 020802.

Paper No: EP-20-1043

DOI: https://doi.org/10.1115/1.4048011

Published Online: September 3, 2020

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Topics: Buckling, Deformation, Delamination, Failure, Fracture (Materials), Fracture (Process), Patents, Stress, Coatings

Journal Articles

State of the Art of Lead-Free Solder Joint Reliability

John H. Lau

J. Electron. Packag. June 2021, 143(2): 020803.

Paper No: EP-20-1059

DOI: https://doi.org/10.1115/1.4048037

Published Online: September 3, 2020

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Topics: Alloys, Creep, Failure, Reliability, Solder joints, Solders, Temperature, Viscoplasticity, Lead-free solders, Stress

Journal Articles

Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating Conditions

Alex Davila-Frias, Shah Limon, Val Marinov, Om Prakash Yadav

J. Electron. Packag. June 2021, 143(2): 021003.

Paper No: EP-20-1042

DOI: https://doi.org/10.1115/1.4048035

Published Online: August 27, 2020

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Topics: Damage, Failure, Reliability, Stress, Electronics

Journal Articles

Review of Methodologies for Structural Integrity Evaluation of Power Modules

Noriyuki Miyazaki, Nobuyuki Shishido, Yutaka Hayama

J. Electron. Packag. June 2021, 143(2): 020801.

Paper No: EP-20-1074

DOI: https://doi.org/10.1115/1.4048038

Published Online: August 27, 2020

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Topics: Cracking (Materials), Creep, Cycles, Density, Failure, Fatigue, Fracture (Materials), Fracture (Process), Temperature, Wire

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Journal citation

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Supplemental Material

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads

Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications

Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours

A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones

State of the Art of Lead-Free Solder Joint Reliability

Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating Conditions

Review of Methodologies for Structural Integrity Evaluation of Power Modules

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