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Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks

J. Electron. Packag. September 2023, 145(3): 031006.

Paper No: EP-22-1008

DOI: https://doi.org/10.1115/1.4056640

Published Online: February 1, 2023

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Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation

Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller

J. Electron. Packag. June 2022, 144(2): 021119.

Paper No: EP-21-1057

DOI: https://doi.org/10.1115/1.4054131

Published Online: April 22, 2022

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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature

Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim

J. Electron. Packag. December 2022, 144(4): 041017.

Paper No: EP-21-1014

DOI: https://doi.org/10.1115/1.4054183

Published Online: April 22, 2022

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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress

Includes: Supplementary data

Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. December 2022, 144(4): 041012.

Paper No: EP-21-1136

DOI: https://doi.org/10.1115/1.4053365

Published Online: January 28, 2022

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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries

Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li

J. Electron. Packag. December 2022, 144(4): 041005.

Paper No: EP-21-1036

DOI: https://doi.org/10.1115/1.4052246

Published Online: November 22, 2021

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Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature

Journal Articles

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

Jimmy Chuang, Jin Yang, David Shia, Y. L. Li

J. Electron. Packag. December 2021, 143(4): 041108.

Paper No: EP-21-1037

DOI: https://doi.org/10.1115/1.4052711

Published Online: November 2, 2021

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Topics: Boiling, Cooling, Electronic packages, Injection molding, Metals, Printing, Additive manufacturing, Flat heat pipes, Manufacturing

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

Chang-Chun Lee, Kuo-Shu Kao, Chi-Wei Wang, Tai-Jyun Yu, Tai-Kuang Lee, Po-Kai Chiu

J. Electron. Packag. June 2022, 144(2): 021101.

Paper No: EP-21-1047

DOI: https://doi.org/10.1115/1.4052072

Published Online: September 13, 2021

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Topics: Manufacturing, Metals, Molding materials, Reliability, Silicones, Solders, Epoxy resins, Finite element analysis, Mechanical behavior

Journal Articles

Comparative Study on Power Module Architectures for Modularity and Scalability

Mei-Chien Lu

J. Electron. Packag. December 2020, 142(4): 040801.

Paper No: EP-19-1126

DOI: https://doi.org/10.1115/1.4047472

Published Online: June 29, 2020

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Topics: Architecture, Cooling, Design, Electric vehicles, Electronics, Patents, Hybrid electric vehicles, Traction, Coolants, Metals

Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury

J. Electron. Packag. December 2020, 142(4): 041107.

Paper No: EP-19-1131

DOI: https://doi.org/10.1115/1.4047409

Published Online: June 26, 2020

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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)

Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler

J. Electron. Packag. September 2020, 142(3): 031110.

Paper No: EP-20-1013

DOI: https://doi.org/10.1115/1.4047063

Published Online: May 13, 2020

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Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability

Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. September 2020, 142(3): 031107.

Paper No: EP-19-1129

DOI: https://doi.org/10.1115/1.4046849

Published Online: April 24, 2020

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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density

Journal Articles

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Xiaohui Song, Rui Zhang, Huadong Zhao

J. Electron. Packag. June 2020, 142(2): 021005.

Paper No: EP-19-1105

DOI: https://doi.org/10.1115/1.4046164

Published Online: February 19, 2020

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Topics: Atoms, Bonding, Copper, Metals, Nanoparticles, Pressure, Temperature, Deformation, External pressure

Journal Articles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede

J. Electron. Packag. March 2020, 142(1): 011003.

Paper No: EP-19-1014

DOI: https://doi.org/10.1115/1.4044476

Published Online: September 19, 2019

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Topics: Bonding, Electronics, High temperature, Manufacturing, Stress, Tension-leg platforms, Thermal stresses, Tin, Transients (Dynamics), Temperature

Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen

J. Electron. Packag. December 2018, 140(4): 041007.

Paper No: EP-18-1041

DOI: https://doi.org/10.1115/1.4041014

Published Online: September 10, 2018

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Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress

Journal Articles

Electroplated Connections Between Carbon Fiber and Nickel

Christopher Bilger, Hugh A. Bruck, Abhijit Dasgupta

J. Electron. Packag. March 2017, 139(1): 011009.

Paper No: EP-16-1045

DOI: https://doi.org/10.1115/1.4035703

Published Online: January 27, 2017

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Topics: Carbon fibers, Nickel, Metals, Carbon, Solders, Batteries, Electroplating

Journal Articles

Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials

Yunxia Gao, Xianping Wang, Jing Liu, Qianfeng Fang

J. Electron. Packag. March 2017, 139(1): 011002.

Paper No: EP-16-1099

DOI: https://doi.org/10.1115/1.4035025

Published Online: November 23, 2016

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Topics: Alloys, Copper, Gallium, Gallium alloys, Temperature, Thermal conductivity, Oxidation, Thermal resistance, Aluminum alloys, Metals

Journal Articles

Nanothermal Interface Materials: Technology Review and Recent Results

Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi

J. Electron. Packag. December 2015, 137(4): 040803.

Paper No: EP-15-1063

DOI: https://doi.org/10.1115/1.4031602

Published Online: October 9, 2015

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Topics: Copper, Cycles, Electrical resistivity, Solders, Teams, Temperature, Testing, Thermal resistance, Bonding, Accelerated life testing

Journal Articles

Electromigration Simulation for Metal Lines

JianPing Jing, Lihua Liang, Guang Meng

J. Electron. Packag. March 2010, 132(1): 011002.

DOI: https://doi.org/10.1115/1.4000716

Published Online: March 4, 2010

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Topics: Algorithms, Atoms, Density, Electrodiffusion, Simulation, Stress, Current density, Failure, Metals, Temperature

Journal Articles

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

H. A. Mustain, William D. Brown, Simon S. Ang

J. Electron. Packag. September 2009, 131(3): 034502.

DOI: https://doi.org/10.1115/1.3153582

Published Online: July 14, 2009

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Topics: Copper, Diffusion (Physics), Silicon, Silicon nitride ceramics, Tungsten, Annealing, High temperature, Metals, Temperature, Electron spectroscopy

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Journal citation

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Supplemental Material

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module With Insulated Metal Substrate

Comparative Study on Power Module Architectures for Modularity and Scalability

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Atomic Study on Copper–Copper Bonding Using Nanoparticles

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Electroplated Connections Between Carbon Fiber and Nickel

Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials

Nanothermal Interface Materials: Technology Review and Recent Results

Electromigration Simulation for Metal Lines

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

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