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Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
https://doi.org/10.1115/1.4032349
Published Online: March 10, 2016
View Article titled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects in another window
Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Journal Articles

Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method

T. Elperin, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 142–147.
https://doi.org/10.1115/1.1649245
Published Online: April 30, 2004
View Article titled, Controlled Fracture of Nonmetallic Thin Wafers Using a Laser Thermal Shock Method
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Topics: Fracture (Materials), Laser beams, Lasers, Microcracks, Semiconductor wafers, Thermal shock, Thermal stresses, Temperature
Journal Articles

Statistical Aspects of Lifetime in the Presence of UV Radiation

Michael I. Zeifman, Dov Ingman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 1–3.
https://doi.org/10.1115/1.1498263
Published Online: March 14, 2003
View Article titled, Statistical Aspects of Lifetime in the Presence of UV Radiation
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Topics: Composite materials, Reliability, Shapes, Stress, Ultraviolet radiation, Damage, Rupture, Weibull distribution, Microcracks, Testing
Journal Articles

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

T. Elperin, A. Kornilov, G. Rudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 317–322.
https://doi.org/10.1115/1.1289635
Published Online: August 9, 1999
View Article titled, Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips
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Topics: Microcracks, Semiconductor wafers, Separation (Technology), Temperature, Laser beams, Sprays, Elasticity, Stress, Temperature distribution, Relaxation (Physics)
Journal Articles

Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages

Mary J. Li, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 225–229.
https://doi.org/10.1115/1.2792096
Published Online: September 1, 1995
View Article titled, Environmental Scanning Electron Microscopic Investigation of Failure Mechanisms in Electronic Packages
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Topics: Electronic packages, Electrons, Failure mechanisms, Bonding, Failure, Fibers, Microcracks, Printed circuit boards, Resins, Scanning electron microscopy
Journal Articles

Crack Propagation in Solder Joints During Thermal-Mechanical Cycling

Ronald G. Ross, Jr., Liang-chi Wen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 69–75.
https://doi.org/10.1115/1.2905507
Published Online: June 1, 1994
View Article titled, Crack Propagation in Solder Joints During Thermal-Mechanical Cycling
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Topics: Crack propagation, Solder joints, Failure, Creep, Cycles, Finite element analysis, Fracture (Materials), Solders, Computer software, Cracking (Materials)